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stmbl/hw/kicad/bob/db25_bob/db25_bob.kicad_pcb

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Final version.
2015-11-29 23:35:28 +00:00
(kicad_pcb (version 4) (host pcbnew "(2015-11-22 BZR 6327)-product")
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(general
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(links 324)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(no_connects 0)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(area 141.910999 42.088999 241.883001 142.061001)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(thickness 1.6)
Final version.
2015-11-29 23:35:28 +00:00
(drawings 6)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(tracks 1354)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(zones 0)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(modules 97)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(nets 145)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
)
(page A4)
(layers
(0 F.Cu signal)
(31 B.Cu signal)
(32 B.Adhes user)
(33 F.Adhes user)
(34 B.Paste user)
(35 F.Paste user)
(36 B.SilkS user)
(37 F.SilkS user)
(38 B.Mask user)
(39 F.Mask user)
(40 Dwgs.User user)
(41 Cmts.User user)
(42 Eco1.User user)
(43 Eco2.User user)
(44 Edge.Cuts user)
(45 Margin user)
(46 B.CrtYd user)
(47 F.CrtYd user)
(48 B.Fab user)
(49 F.Fab user)
)
(setup
Final version.
2015-11-29 23:35:28 +00:00
(last_trace_width 0.25)
Major routing done
2015-11-22 00:17:10 +00:00
(user_trace_width 0.5)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(trace_clearance 0.22)
Major routing done
2015-11-22 00:17:10 +00:00
(zone_clearance 0.254)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(zone_45_only no)
(trace_min 0.2)
(segment_width 0.2)
(edge_width 0.15)
(via_size 0.6)
(via_drill 0.4)
(via_min_size 0.4)
(via_min_drill 0.3)
(uvia_size 0.3)
(uvia_drill 0.1)
(uvias_allowed no)
(uvia_min_size 0.2)
(uvia_min_drill 0.1)
(pcb_text_width 0.3)
(pcb_text_size 1.5 1.5)
(mod_edge_width 0.15)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 1.524 1.524)
(pad_drill 0.762)
(pad_to_mask_clearance 0.2)
(aux_axis_origin 0 0)
(visible_elements FFFFFF7F)
(pcbplotparams
(layerselection 0x00030_80000001)
(usegerberextensions false)
(excludeedgelayer true)
(linewidth 0.100000)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15)
(hpglpenoverlay 2)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(padsonsilk false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
routed some more.
2015-11-17 16:48:00 +00:00
(drillshape 0)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(scaleselection 1)
(outputdirectory ""))
)
(net 0 "")
(net 1 IO0)
(net 2 IO2)
(net 3 IO4)
(net 4 IO6)
(net 5 IO8)
(net 6 IO9)
(net 7 IO10)
(net 8 IO11)
(net 9 IO12)
(net 10 IO13)
(net 11 IO14)
(net 12 IO15)
(net 13 IO16)
(net 14 IO1)
(net 15 IO3)
(net 16 IO5)
(net 17 IO7)
(net 18 GND)
(net 19 +5V)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA)
routed some more.
2015-11-17 16:48:00 +00:00
(net 21 "Net-(D1-Pad1)")
(net 22 "Net-(D2-Pad1)")
(net 23 "Net-(D3-Pad1)")
(net 24 IN0P)
(net 25 IN1P)
(net 26 IN2P)
(net 27 0RX)
(net 28 0TX)
(net 29 0RX+)
(net 30 0RX-)
(net 31 1RX)
(net 32 1TX)
(net 33 1RX+)
(net 34 1RX-)
(net 35 IN0R)
(net 36 IN1R)
(net 37 IN2R)
(net 38 "Net-(P3-Pad6)")
(net 39 2RX)
(net 40 2TX)
(net 41 2RX+)
(net 42 2RX-)
(net 43 3RX)
(net 44 3TX)
(net 45 3RX+)
(net 46 3RX-)
(net 47 4RX)
(net 48 4TX)
(net 49 4RX+)
(net 50 4RX-)
(net 51 IN0)
(net 52 IN1)
(net 53 IN2)
(net 54 OUT0)
(net 55 OUT1)
(net 56 OUT2)
(net 57 ENC0AO)
(net 58 ENC0ZO)
(net 59 ENC1BO)
(net 60 ENC2AO)
(net 61 ENC2ZO)
(net 62 ENC3AO)
(net 63 ENC3BO)
(net 64 ENC3ZO)
(net 65 ENC0BO)
(net 66 ENC1AO)
(net 67 ENC1ZO)
(net 68 ENC2BO)
(net 69 ENC0A+)
(net 70 ENC0A-)
(net 71 ENC0B+)
(net 72 ENC0Z-)
(net 73 ENC0Z+)
(net 74 ENC0B-)
(net 75 ENC1A+)
(net 76 ENC1A-)
(net 77 ENC1B+)
(net 78 ENC1Z-)
(net 79 ENC1Z+)
(net 80 ENC1B-)
(net 81 ENC2A+)
(net 82 ENC2A-)
(net 83 ENC2B+)
(net 84 ENC2Z-)
(net 85 ENC2Z+)
(net 86 ENC2B-)
(net 87 ENC3A+)
(net 88 ENC3A-)
(net 89 ENC3B+)
(net 90 ENC3Z-)
(net 91 ENC3Z+)
(net 92 ENC3B-)
(net 93 ENC0A)
(net 94 ENC0Z)
(net 95 ENC1A)
(net 96 EN-)
(net 97 ENC0B)
(net 98 ENC1B)
(net 99 ENC2B)
(net 100 ENC2A)
(net 101 ENC1Z)
(net 102 ENC2Z)
(net 103 ENC3Z)
(net 104 ENC3B)
(net 105 ENC3A)
(net 106 "Net-(J7-Pad3)")
(net 107 0TX-)
(net 108 0TX+)
(net 109 "Net-(J7-Pad6)")
(net 110 "Net-(J8-Pad3)")
(net 111 2TX-)
(net 112 2TX+)
(net 113 "Net-(J8-Pad6)")
(net 114 "Net-(J9-Pad3)")
(net 115 4TX-)
(net 116 4TX+)
(net 117 "Net-(J9-Pad6)")
(net 118 "Net-(J10-Pad3)")
(net 119 1TX-)
(net 120 1TX+)
(net 121 "Net-(J10-Pad6)")
(net 122 "Net-(J11-Pad3)")
(net 123 3TX-)
(net 124 3TX+)
(net 125 "Net-(J11-Pad6)")
(net 126 +24V)
(net 127 OUT0FET)
(net 128 OUT1FET)
(net 129 OUT2FET)
Final version.
2015-11-29 23:35:28 +00:00
(net 130 "Net-(J2-Pad1)")
(net 131 "Net-(J2-Pad2)")
(net 132 "Net-(J2-Pad3)")
(net 133 "Net-(J2-Pad14)")
(net 134 "Net-(J2-Pad15)")
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 135 5V0)
(net 136 GND0)
(net 137 5V1)
(net 138 GND1)
(net 139 5V2)
(net 140 GND2)
(net 141 5V3)
(net 142 GND3)
(net 143 5V4)
(net 144 GND4)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net_class Default "This is the default net class."
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(clearance 0.22)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(trace_width 0.25)
(via_dia 0.6)
(via_drill 0.4)
(uvia_dia 0.3)
(uvia_drill 0.1)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net +24V)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(add_net +5V)
Added more isolators.
2015-11-03 23:01:56 +00:00
(add_net +5VA)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net 0RX)
(add_net 0RX+)
(add_net 0RX-)
(add_net 0TX)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net 0TX+)
(add_net 0TX-)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net 1RX)
(add_net 1RX+)
(add_net 1RX-)
(add_net 1TX)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net 1TX+)
(add_net 1TX-)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net 2RX)
(add_net 2RX+)
(add_net 2RX-)
(add_net 2TX)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net 2TX+)
(add_net 2TX-)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net 3RX)
(add_net 3RX+)
(add_net 3RX-)
(add_net 3TX)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net 3TX+)
(add_net 3TX-)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net 4RX)
(add_net 4RX+)
(add_net 4RX-)
(add_net 4TX)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net 4TX+)
(add_net 4TX-)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(add_net 5V0)
(add_net 5V1)
(add_net 5V2)
(add_net 5V3)
(add_net 5V4)
Latest changes.
2015-11-08 15:13:56 +00:00
(add_net EN-)
(add_net ENC0A)
(add_net ENC0A+)
(add_net ENC0A-)
(add_net ENC0AO)
(add_net ENC0B)
(add_net ENC0B+)
(add_net ENC0B-)
(add_net ENC0BO)
(add_net ENC0Z)
(add_net ENC0Z+)
(add_net ENC0Z-)
(add_net ENC0ZO)
(add_net ENC1A)
(add_net ENC1A+)
(add_net ENC1A-)
(add_net ENC1AO)
(add_net ENC1B)
(add_net ENC1B+)
(add_net ENC1B-)
(add_net ENC1BO)
(add_net ENC1Z)
(add_net ENC1Z+)
(add_net ENC1Z-)
(add_net ENC1ZO)
(add_net ENC2A)
(add_net ENC2A+)
(add_net ENC2A-)
(add_net ENC2AO)
(add_net ENC2B)
(add_net ENC2B+)
(add_net ENC2B-)
(add_net ENC2BO)
(add_net ENC2Z)
(add_net ENC2Z+)
(add_net ENC2Z-)
(add_net ENC2ZO)
(add_net ENC3A)
(add_net ENC3A+)
(add_net ENC3A-)
(add_net ENC3AO)
(add_net ENC3B)
(add_net ENC3B+)
(add_net ENC3B-)
(add_net ENC3BO)
(add_net ENC3Z)
(add_net ENC3Z+)
(add_net ENC3Z-)
(add_net ENC3ZO)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(add_net GND)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(add_net GND0)
(add_net GND1)
(add_net GND2)
(add_net GND3)
(add_net GND4)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net IN0)
(add_net IN0P)
(add_net IN0R)
(add_net IN1)
(add_net IN1P)
(add_net IN1R)
(add_net IN2)
(add_net IN2P)
(add_net IN2R)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(add_net IO0)
(add_net IO1)
(add_net IO10)
(add_net IO11)
(add_net IO12)
(add_net IO13)
(add_net IO14)
(add_net IO15)
(add_net IO16)
(add_net IO2)
(add_net IO3)
(add_net IO4)
(add_net IO5)
(add_net IO6)
(add_net IO7)
(add_net IO8)
(add_net IO9)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net "Net-(D1-Pad1)")
(add_net "Net-(D2-Pad1)")
(add_net "Net-(D3-Pad1)")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net "Net-(J10-Pad3)")
(add_net "Net-(J10-Pad6)")
(add_net "Net-(J11-Pad3)")
(add_net "Net-(J11-Pad6)")
routed some more.
2015-11-17 16:48:00 +00:00
(add_net "Net-(J2-Pad1)")
(add_net "Net-(J2-Pad14)")
(add_net "Net-(J2-Pad15)")
(add_net "Net-(J2-Pad2)")
(add_net "Net-(J2-Pad3)")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net "Net-(J7-Pad3)")
(add_net "Net-(J7-Pad6)")
(add_net "Net-(J8-Pad3)")
(add_net "Net-(J8-Pad6)")
(add_net "Net-(J9-Pad3)")
(add_net "Net-(J9-Pad6)")
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net "Net-(P3-Pad6)")
(add_net OUT0)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net OUT0FET)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net OUT1)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net OUT1FET)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(add_net OUT2)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(add_net OUT2FET)
)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(module Fiducials:Fiducial_1mm_Dia_2.54mm_Outer_CopperTop (layer F.Cu) (tedit 565CB710) (tstamp 565CB6FC)
(at 233.172 115.189)
(descr "Circular Fiducial, 1mm bare copper top; 2.54mm keepout")
(tags marker)
(attr virtual)
(fp_text reference REF** (at 3.4 0.7) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Fiducial_1mm_Dia_2.54mm_Outer_CopperTop (at 0 -1.8) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 1.55 0) (layer F.CrtYd) (width 0.05))
(pad ~ smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
(solder_mask_margin 0.77) (clearance 0.77))
)
Final version.
2015-11-29 23:35:28 +00:00
(module custom_footprints:SIP7 (layer F.Cu) (tedit 565B89CF) (tstamp 56510338)
(at 230.4415 100.584 270)
(path /565150F1)
(fp_text reference P15 (at 0 2.032 270) (layer F.SilkS)
(effects (font (thickness 0.15)))
)
(fp_text value CONN_4 (at 0 -2.794 270) (layer F.SilkS)
(effects (font (thickness 0.15)))
)
(fp_line (start -8.24 -1.2) (end 10.78 -1.2) (layer F.SilkS) (width 0.127))
(fp_line (start 10.78 -1.2) (end 10.78 4.8) (layer F.SilkS) (width 0.127))
(fp_line (start 10.78 4.8) (end -8.24 4.8) (layer F.SilkS) (width 0.127))
(fp_line (start -8.24 4.8) (end -8.24 -1.2) (layer F.SilkS) (width 0.127))
(fp_line (start 0 0) (end 0 3.81) (layer F.SilkS) (width 0.127))
(pad 1 thru_hole oval (at -6.35 0) (size 2.616 1.308) (drill 0.8) (layers *.Cu *.Mask)
(net 126 +24V))
(pad 2 thru_hole oval (at -3.81 0) (size 2.616 1.308) (drill 0.8) (layers *.Cu *.Mask)
(net 96 EN-))
(pad 3 thru_hole oval (at 3.81 0) (size 2.616 1.308) (drill 0.8) (layers *.Cu *.Mask)
(net 96 EN-))
(pad 4 thru_hole oval (at 8.89 0) (size 2.616 1.308) (drill 0.8) (layers *.Cu *.Mask)
(net 20 +5VA))
(pad 3 thru_hole oval (at 1.27 0 270) (size 1.3 2.6) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
(net 96 EN-))
(pad 4 thru_hole oval (at 6.35 0 270) (size 1.3 2.6) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
(net 20 +5VA))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Transistors_SMD:sc70 (layer F.Cu) (tedit 563FCB81) (tstamp 563FD899)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.632 62.992 270)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "SC70 SOT323")
(path /5641787F)
(attr smd)
(fp_text reference Q1 (at 0.95 -1 270) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value FET_N (at 1.85 0.25 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.1 -0.55) (end -1.1 0.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.1 0.55) (end 1.1 0.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.1 0.55) (end 1.1 -0.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.1 -0.55) (end -1.05 -0.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.05 -0.55) (end -1.1 -0.55) (layer F.SilkS) (width 0.15))
(pad G smd rect (at -0.6604 1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 54 OUT0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad S smd rect (at 0.6604 1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad D smd rect (at 0 -1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 127 OUT0FET))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Transistors_SMD.3dshapes/sc70.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Transistors_SMD:sc70 (layer F.Cu) (tedit 563FCB71) (tstamp 563FD8A7)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.632 49.022 270)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "SC70 SOT323")
(path /56417AD1)
(attr smd)
(fp_text reference Q3 (at 0.95 -1 270) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value FET_N (at 1.85 0.25 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.1 -0.55) (end -1.1 0.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.1 0.55) (end 1.1 0.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.1 0.55) (end 1.1 -0.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.1 -0.55) (end -1.05 -0.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.05 -0.55) (end -1.1 -0.55) (layer F.SilkS) (width 0.15))
(pad G smd rect (at -0.6604 1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 56 OUT2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad S smd rect (at 0.6604 1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad D smd rect (at 0 -1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 129 OUT2FET))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Transistors_SMD.3dshapes/sc70.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Transistors_SMD:sc70 (layer F.Cu) (tedit 563FCB1C) (tstamp 563FD8A0)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.632 55.88 270)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "SC70 SOT323")
(path /564179AE)
(attr smd)
(fp_text reference Q2 (at 0.95 -1 270) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value FET_N (at 1.85 0.25 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.1 -0.55) (end -1.1 0.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.1 0.55) (end 1.1 0.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.1 0.55) (end 1.1 -0.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.1 -0.55) (end -1.05 -0.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.05 -0.55) (end -1.1 -0.55) (layer F.SilkS) (width 0.15))
(pad G smd rect (at -0.6604 1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 55 OUT1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad S smd rect (at 0.6604 1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad D smd rect (at 0 -1.016 270) (size 0.4572 0.7112) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 128 OUT1FET))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Transistors_SMD.3dshapes/sc70.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
)
(module Connect:DB25FD (layer F.Cu) (tedit 0) (tstamp 56392BE0)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 148.446 112.948 270)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(descr "Connecteur DB25 femelle droit")
(tags "CONN DB25")
(path /56392616)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference J1 (at -15.24 -5.08 450) (layer F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DB25 (at 12.7 -5.08 450) (layer F.Fab)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -25.654 -3.175) (end -25.654 -3.175) (layer F.SilkS) (width 0.15))
(fp_line (start -25.654 -3.175) (end -25.654 3.175) (layer F.SilkS) (width 0.15))
(fp_line (start -25.654 3.175) (end 25.781 3.175) (layer F.SilkS) (width 0.15))
(fp_line (start 25.781 3.175) (end 25.781 -3.175) (layer F.SilkS) (width 0.15))
(fp_line (start 25.781 -3.175) (end -25.527 -3.175) (layer F.SilkS) (width 0.15))
(fp_line (start -25.527 -3.175) (end -25.654 -3.175) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 0 thru_hole circle (at -23.495 0 270) (size 3.81 3.81) (drill 3.048) (layers *.Cu *.Mask F.SilkS))
(pad 0 thru_hole circle (at 23.495 0 270) (size 3.81 3.81) (drill 3.048) (layers *.Cu *.Mask F.SilkS))
(pad 1 thru_hole rect (at 16.637 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 13 IO16))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at 13.843 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 8 IO11))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at 11.049 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 10 IO13))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at 8.255 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 12 IO15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 5.461 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 14 IO1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 2.794 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 2 IO2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 0 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 15 IO3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at -2.794 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 3 IO4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 9 thru_hole circle (at -5.588 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 16 IO5))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 10 thru_hole circle (at -8.382 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 4 IO6))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 11 thru_hole circle (at -11.049 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 17 IO7))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 12 thru_hole circle (at -13.843 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 5 IO8))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 13 thru_hole circle (at -16.637 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 6 IO9))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 14 thru_hole circle (at 15.24 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 7 IO10))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 15 thru_hole circle (at 12.446 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 9 IO12))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 16 thru_hole circle (at 9.652 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 11 IO14))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 17 thru_hole circle (at 6.985 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 1 IO0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 18 thru_hole circle (at 4.191 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 19 thru_hole circle (at 1.397 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 20 thru_hole circle (at -1.397 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 21 thru_hole circle (at -4.191 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 22 thru_hole circle (at -6.858 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 23 thru_hole circle (at -9.652 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 24 thru_hole circle (at -12.446 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 25 thru_hole circle (at -15.24 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 19 +5V))
(model Connect.3dshapes/DB25FD.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A21EC)
(at 149.04 71.806)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FE0C)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C1 (at 0 -2.7) (layer F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 143 5V4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 144 GND4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A21F2)
(at 161.04 83.298)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F997)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C2 (at 0 -2.7) (layer F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A21F8)
(at 155.04 71.805999)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FDE2)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C3 (at 0 -2.7) (layer F.SilkS)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 141 5V3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 142 GND3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(rotate (xyz 0 0 0))
Added more isolators.
2015-11-03 23:01:56 +00:00
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A21FE)
(at 155.039999 83.298001)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F65A)
Added more isolators.
2015-11-03 23:01:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C4 (at 0 -2.7) (layer F.SilkS)
Added more isolators.
2015-11-03 23:01:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Added more isolators.
2015-11-03 23:01:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Added more isolators.
2015-11-03 23:01:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Added more isolators.
2015-11-03 23:01:56 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2204)
(at 161.04 71.806)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FDE8)
Added more isolators.
2015-11-03 23:01:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C5 (at 0 -2.7) (layer F.SilkS)
Added more isolators.
2015-11-03 23:01:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Added more isolators.
2015-11-03 23:01:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 139 5V2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 140 GND2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Added more isolators.
2015-11-03 23:01:56 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A220A)
(at 167.04 83.298)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F77D)
Added more isolators.
2015-11-03 23:01:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C6 (at 0 -2.7) (layer F.SilkS)
Added more isolators.
2015-11-03 23:01:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Added more isolators.
2015-11-03 23:01:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Added more isolators.
2015-11-03 23:01:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Added more isolators.
2015-11-03 23:01:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2210)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 167.04 71.806)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FDEE)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C7 (at 0 -2.7) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 137 5V1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 138 GND1))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2216)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 173.040001 83.298)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F825)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C8 (at 0 -2.7) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A221C)
routed some more.
2015-11-17 16:48:00 +00:00
(at 218.935877 78.787513 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FDF4)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C9 (at 0 -2.7 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.7 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2222)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 149.04 83.298)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F869)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C10 (at 0 -2.7) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2228)
routed some more.
2015-11-17 16:48:00 +00:00
(at 218.935877 66.787513 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FDFA)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C11 (at 0 -2.7 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.7 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A222E)
routed some more.
2015-11-17 16:48:00 +00:00
(at 206.935877 78.787513 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F8AE)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C12 (at 0 -2.7 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.7 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2234)
routed some more.
2015-11-17 16:48:00 +00:00
(at 218.935877 72.787514 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FE00)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C13 (at 0 -2.7 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.7 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A223A)
routed some more.
2015-11-17 16:48:00 +00:00
(at 206.935876 72.787514 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F8FA)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C14 (at 0 -2.7 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.7 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2240)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 173.04 71.805999)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639FE06)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C15 (at 0 -2.7) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 135 5V0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 136 GND0))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563A2246)
routed some more.
2015-11-17 16:48:00 +00:00
(at 206.935877 66.787513 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5639F949)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C16 (at 0 -2.7 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.7 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.5 0 270) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Connect:DB25FD (layer F.Cu) (tedit 0) (tstamp 563A2265)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 162.179 112.903 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Connecteur DB25 femelle droit")
(tags "CONN DB25")
(path /563A2AF8/563A2DB1)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference J2 (at -15.24 -5.08 450) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DB25 (at 12.7 -5.08 450) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -25.654 -3.175) (end -25.654 -3.175) (layer F.SilkS) (width 0.15))
(fp_line (start -25.654 -3.175) (end -25.654 3.175) (layer F.SilkS) (width 0.15))
(fp_line (start -25.654 3.175) (end 25.781 3.175) (layer F.SilkS) (width 0.15))
(fp_line (start 25.781 3.175) (end 25.781 -3.175) (layer F.SilkS) (width 0.15))
(fp_line (start 25.781 -3.175) (end -25.527 -3.175) (layer F.SilkS) (width 0.15))
(fp_line (start -25.527 -3.175) (end -25.654 -3.175) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 0 thru_hole circle (at -23.495 0 270) (size 3.81 3.81) (drill 3.048) (layers *.Cu *.Mask F.SilkS))
(pad 0 thru_hole circle (at 23.495 0 270) (size 3.81 3.81) (drill 3.048) (layers *.Cu *.Mask F.SilkS))
(pad 1 thru_hole rect (at 16.637 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Final version.
2015-11-29 23:35:28 +00:00
(net 130 "Net-(J2-Pad1)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at 13.843 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Final version.
2015-11-29 23:35:28 +00:00
(net 131 "Net-(J2-Pad2)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at 11.049 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Final version.
2015-11-29 23:35:28 +00:00
(net 132 "Net-(J2-Pad3)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at 8.255 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 64 ENC3ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 5.461 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 60 ENC2AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 2.794 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 61 ENC2ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 0 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 68 ENC2BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at -2.794 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 59 ENC1BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 9 thru_hole circle (at -5.588 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 66 ENC1AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 10 thru_hole circle (at -8.382 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 67 ENC1ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 11 thru_hole circle (at -11.049 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 58 ENC0ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 12 thru_hole circle (at -13.843 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 57 ENC0AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 13 thru_hole circle (at -16.637 -1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 65 ENC0BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 14 thru_hole circle (at 15.24 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Final version.
2015-11-29 23:35:28 +00:00
(net 133 "Net-(J2-Pad14)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 15 thru_hole circle (at 12.446 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Final version.
2015-11-29 23:35:28 +00:00
(net 134 "Net-(J2-Pad15)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 16 thru_hole circle (at 9.652 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 62 ENC3AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 17 thru_hole circle (at 6.985 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 63 ENC3BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 18 thru_hole circle (at 4.191 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 19 thru_hole circle (at 1.397 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 20 thru_hole circle (at -1.397 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 21 thru_hole circle (at -4.191 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 22 thru_hole circle (at -6.858 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 23 thru_hole circle (at -9.652 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 24 thru_hole circle (at -12.446 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 25 thru_hole circle (at -15.24 1.397 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Connect.3dshapes/DB25FD.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module LEDs:LED-0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 563A26C2)
Major routing done
2015-11-22 00:17:10 +00:00
(at 203.835 63.119 180)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /563A53E1)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference D2 (at 0 -1.75 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value LED (at 0 1.75 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 0.75) (end 1.1 0.75) (layer F.SilkS) (width 0.15))
(fp_line (start -1.6 -0.75) (end 1.1 -0.75) (layer F.SilkS) (width 0.15))
(fp_line (start -0.1 0.15) (end -0.1 -0.1) (layer F.SilkS) (width 0.15))
(fp_line (start -0.1 -0.1) (end -0.25 0.05) (layer F.SilkS) (width 0.15))
(fp_line (start -0.35 -0.35) (end -0.35 0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 0) (end 0.35 0) (layer F.SilkS) (width 0.15))
(fp_line (start -0.35 0) (end 0 -0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 -0.35) (end 0 0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 0.35) (end -0.35 0) (layer F.SilkS) (width 0.15))
(fp_line (start 1.9 -0.95) (end 1.9 0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.9 0.95) (end -1.9 0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 0.95) (end -1.9 -0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 -0.95) (end 1.9 -0.95) (layer F.CrtYd) (width 0.05))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 1.04902 0) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1.04902 0) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
(net 22 "Net-(D2-Pad1)"))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model LEDs.3dshapes/LED-0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module LEDs:LED-0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 563A26C8)
Major routing done
2015-11-22 00:17:10 +00:00
(at 153.924 134.366 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /563A59FE)
(attr smd)
Major routing done
2015-11-22 00:17:10 +00:00
(fp_text reference D3 (at 0 -1.75 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Major routing done
2015-11-22 00:17:10 +00:00
(fp_text value LED (at 0 1.75 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 0.75) (end 1.1 0.75) (layer F.SilkS) (width 0.15))
(fp_line (start -1.6 -0.75) (end 1.1 -0.75) (layer F.SilkS) (width 0.15))
(fp_line (start -0.1 0.15) (end -0.1 -0.1) (layer F.SilkS) (width 0.15))
(fp_line (start -0.1 -0.1) (end -0.25 0.05) (layer F.SilkS) (width 0.15))
(fp_line (start -0.35 -0.35) (end -0.35 0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 0) (end 0.35 0) (layer F.SilkS) (width 0.15))
(fp_line (start -0.35 0) (end 0 -0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 -0.35) (end 0 0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 0.35) (end -0.35 0) (layer F.SilkS) (width 0.15))
(fp_line (start 1.9 -0.95) (end 1.9 0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.9 0.95) (end -1.9 0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 0.95) (end -1.9 -0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 -0.95) (end 1.9 -0.95) (layer F.CrtYd) (width 0.05))
Major routing done
2015-11-22 00:17:10 +00:00
(pad 2 smd rect (at 1.04902 0 90) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 18 GND))
Major routing done
2015-11-22 00:17:10 +00:00
(pad 1 smd rect (at -1.04902 0 90) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 23 "Net-(D3-Pad1)"))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model LEDs.3dshapes/LED-0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A26CE)
routed some more.
2015-11-17 16:48:00 +00:00
(at 216.435876 62.287512)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563A5311)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R1 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 21 "Net-(D1-Pad1)"))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A26D4)
Major routing done
2015-11-22 00:17:10 +00:00
(at 207.706 63.119 180)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563A53E7)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R2 (at 0 -2.1 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 22 "Net-(D2-Pad1)"))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A26DA)
Major routing done
2015-11-22 00:17:10 +00:00
(at 153.924 130.556 270)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563A5A04)
(attr smd)
Major routing done
2015-11-22 00:17:10 +00:00
(fp_text reference R3 (at 0 -2.1 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Major routing done
2015-11-22 00:17:10 +00:00
(fp_text value R (at 0 2.1 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
Major routing done
2015-11-22 00:17:10 +00:00
(pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(net 13 IO16))
Major routing done
2015-11-22 00:17:10 +00:00
(pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 23 "Net-(D3-Pad1)"))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Housings_SOT-23_SOT-143_TSOT-6:SC-70-6 (layer F.Cu) (tedit 54E926FA) (tstamp 563A8032)
routed some more.
2015-11-17 16:48:00 +00:00
(at 226.822 78.994)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr SC-70-6,)
(tags SC-70-6,)
(path /563AD013)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference P3 (at 0.01016 -3.05054) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL6 (at 0.04064 4.191) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.33096 1.16078) (end -1.33096 1.77038) (layer F.SilkS) (width 0.15))
(fp_line (start -1.33096 1.77038) (end -0.89916 1.78054) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.65024 0.94996) (size 0.39878 0.7493) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 35 IN0R))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 0 0.94996) (size 0.39878 0.7493) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at 0.65024 0.94996) (size 0.39878 0.7493) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 36 IN1R))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at 0.65024 -0.94996) (size 0.39878 0.7493) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 37 IN2R))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 0 -0.94996) (size 0.39878 0.7493) (layers F.Cu F.Paste F.Mask)
(net 20 +5VA))
(pad 6 smd rect (at -0.65024 -0.94996) (size 0.39878 0.7493) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 38 "Net-(P3-Pad6)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOT-23_SOT-143_TSOT-6.3dshapes/SC-70-6.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A805C)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.632 86.868)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563B05DE)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R4 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 35 IN0R))
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 24 IN0P))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A8062)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.698 89.154)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563B05E4)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R5 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 24 IN0P))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A8068)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.698 80.01)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563AFB1C)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R6 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 36 IN1R))
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 25 IN1P))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A806E)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.698 82.296)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563AFC20)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R7 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 25 IN1P))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A8074)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.698 73.152)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563B02F7)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R8 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 37 IN2R))
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 26 IN2P))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A807A)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.632 84.582 180)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563AE572)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R9 (at 0 -2.1 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 51 IN0))
(pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 35 IN0R))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A8080)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.698 77.724 180)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563AE64F)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R10 (at 0 -2.1 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 52 IN1))
(pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 36 IN1R))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A8086)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.632 70.866 180)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /563AE711)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R11 (at 0 -2.1 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 53 IN2))
(pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 37 IN2R))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 563A808C)
routed some more.
2015-11-17 16:48:00 +00:00
(at 230.698001 75.438)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563B02FD)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference R12 (at 0 -2.1) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value R (at 0 2.1) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(net 26 IN2P))
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(model Resistors_SMD.3dshapes/R_0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 563A81CA)
routed some more.
2015-11-17 16:48:00 +00:00
(at 226.822 89.154 180)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 0805")
(path /563B05EA)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C22 (at 0 -2.1 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.1 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
(net 24 IN0P))
(pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 563A81CF)
Major routing done
2015-11-22 00:17:10 +00:00
(at 224.5995 83.312 270)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 0805")
(path /563AFCDF)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
Major routing done
2015-11-22 00:17:10 +00:00
(fp_text reference C23 (at 0 -2.1 270) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Major routing done
2015-11-22 00:17:10 +00:00
(fp_text value C (at 0 2.1 270) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15))
Major routing done
2015-11-22 00:17:10 +00:00
(pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 25 IN1P))
Major routing done
2015-11-22 00:17:10 +00:00
(pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 563A81D4)
routed some more.
2015-11-17 16:48:00 +00:00
(at 226.838 75.438 180)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 0805")
(path /563B0303)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference C24 (at 0 -2.1 180) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value C (at 0 2.1 180) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
(net 26 IN2P))
(pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_0805.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D435D)
(at 220.34 98.662)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /563A2AF8/563D611F)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C25 (at 0 -2.7) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
(net 19 +5V))
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4363)
(at 220.34 110.662)
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /563A2AF8/563D647B)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C26 (at 0 -2.7) (layer F.SilkS)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
(net 20 +5VA))
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4369)
(at 214.34 98.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D61F8)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C27 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D436F)
(at 214.34 110.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D642F)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C28 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4375)
(at 208.34 98.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D6229)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C29 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D437B)
(at 208.340001 110.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D63E6)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C30 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4381)
(at 202.34 98.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D625D)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C31 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4387)
(at 202.34 110.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D63A0)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C32 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D438D)
(at 196.34 98.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D6294)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C33 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4393)
(at 196.34 110.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D635D)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C34 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D4399)
(at 190.34 98.662)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D62CE)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C35 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Changed schematic to current feature set. The bob will use two connections to the Mesa hardware and break out 5 SSerial connections, 4 ABZ encoder interfaces, 5 inputs and 5 outputs.
2015-11-04 23:38:42 +00:00
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D439F)
(at 190.34 110.662001)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563D630B)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C36 (at 0 -2.7) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D43A5)
(at 184.404 110.744 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563E5ABD)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C37 (at 0 -2.7 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value C (at 0 2.7 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0 90) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 20 +5VA))
Latest changes.
2015-11-08 15:13:56 +00:00
(pad 2 smd rect (at 1.5 0 90) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563D43B1)
(at 229.108 122.682)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(path /563A2AF8/563E5D4D)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference C39 (at 0 -2.7) (layer F.SilkS)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(effects (font (size 1 1) (thickness 0.15)))
Latest changes.
2015-11-08 15:13:56 +00:00
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value C (at 0 2.7) (layer F.Fab)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(effects (font (size 1 1) (thickness 0.15)))
Latest changes.
2015-11-08 15:13:56 +00:00
)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest changes.
2015-11-08 15:13:56 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563D43BF)
(at 229.362 136.144)
(tags RJ45)
(path /563A2AF8/563D7321)
(fp_text reference J3 (at 0.254 4.826) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 69 ENC0A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 70 ENC0A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 71 ENC0B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 72 ENC0Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 73 ENC0Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 74 ENC0B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
(net 20 +5VA))
(pad 8 thru_hole circle (at 4.445 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563D43CD)
(at 212.851999 136.144)
(tags RJ45)
(path /563A2AF8/563D7420)
(fp_text reference J4 (at 0.254 4.826) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 75 ENC1A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 76 ENC1A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 77 ENC1B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 78 ENC1Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 79 ENC1Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 80 ENC1B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
(net 20 +5VA))
(pad 8 thru_hole circle (at 4.445 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563D43DB)
(at 196.088 136.144)
(tags RJ45)
(path /563A2AF8/563D751D)
(fp_text reference J5 (at 0.254 4.826) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 81 ENC2A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 82 ENC2A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 83 ENC2B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 84 ENC2Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 85 ENC2Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 86 ENC2B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
(net 20 +5VA))
(pad 8 thru_hole circle (at 4.445 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563D43E9)
(at 179.578 136.144)
(tags RJ45)
(path /563A2AF8/563D74A3)
(fp_text reference J6 (at 0.254 4.826) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 87 ENC3A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 88 ENC3A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 89 ENC3B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 90 ENC3Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 91 ENC3Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 92 ENC3B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
(net 20 +5VA))
(pad 8 thru_hole circle (at 4.445 -8.89) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563F94E7)
(at 219.044519 46.228 180)
(tags RJ45)
(path /563FE95B)
(fp_text reference J7 (at 0.254 4.826 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 108 0TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 107 0TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 106 "Net-(J7-Pad3)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 30 0RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 29 0RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 109 "Net-(J7-Pad6)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 135 5V0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at 4.445 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 136 GND0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563F94F5)
(at 185.674 46.228 180)
(tags RJ45)
(path /563FEB85)
(fp_text reference J8 (at 0.254 4.826 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 112 2TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 111 2TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 110 "Net-(J8-Pad3)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 42 2RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 41 2RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 113 "Net-(J8-Pad6)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 139 5V2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at 4.445 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 140 GND2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563F9503)
(at 152.654 46.228 180)
(tags RJ45)
(path /5640523C)
(fp_text reference J9 (at 0.254 4.826 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 116 4TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 115 4TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 114 "Net-(J9-Pad3)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 50 4RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 49 4RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 117 "Net-(J9-Pad6)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 143 5V4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at 4.445 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 144 GND4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563F9511)
(at 202.3491 46.228 180)
(tags RJ45)
(path /563FEA93)
(fp_text reference J10 (at 0.254 4.826 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 120 1TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 119 1TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 118 "Net-(J10-Pad3)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 34 1RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 33 1RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 121 "Net-(J10-Pad6)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 137 5V1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at 4.445 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 138 GND1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Connect:RJ45_8 (layer F.Cu) (tedit 0) (tstamp 563F951F)
(at 169.164 46.228 180)
(tags RJ45)
(path /563FEC84)
(fp_text reference J11 (at 0.254 4.826 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value RJ45 (at 0.14224 -0.1016 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.62 7.874) (end 7.62 7.874) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 7.874) (end 7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start 7.62 -10.16) (end -7.62 -10.16) (layer F.SilkS) (width 0.15))
(fp_line (start -7.62 -10.16) (end -7.62 7.874) (layer F.SilkS) (width 0.15))
(pad Hole np_thru_hole circle (at 5.93852 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad Hole np_thru_hole circle (at -5.9309 0 180) (size 3.64998 3.64998) (drill 3.2512) (layers *.Cu *.SilkS *.Mask))
(pad 1 thru_hole rect (at -4.445 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 124 3TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole circle (at -3.175 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 123 3TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 thru_hole circle (at -1.905 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 122 "Net-(J11-Pad3)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole circle (at -0.635 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 46 3RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole circle (at 0.635 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(net 45 3RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole circle (at 1.905 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 125 "Net-(J11-Pad6)"))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 thru_hole circle (at 3.175 -6.35 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 141 5V3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 thru_hole circle (at 4.445 -8.89 180) (size 1.50114 1.50114) (drill 0.89916) (layers *.Cu *.Mask F.SilkS)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 142 GND3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Connect.3dshapes/RJ45_8.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.4))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_1210 (layer F.Cu) (tedit 5415D85D) (tstamp 563FCBAF)
Major routing done
2015-11-22 00:17:10 +00:00
(at 236.728 102.0445)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "Capacitor SMD 1210, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 1210")
(path /5640F251)
(attr smd)
(fp_text reference C17 (at 0 -2.7) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value C (at 0 2.7) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 1 -1.475) (end -1 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start -1 1.475) (end 1 1.475) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 126 +24V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at 1.5 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Capacitors_SMD.3dshapes/C_1210.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56392BEC)
routed some more.
2015-11-17 16:48:00 +00:00
(at 212.935877 78.787513)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A36D0)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference U1 (at 0 -3.5) (layer F.SilkS)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value ADuM1201WT (at 0 3.5) (layer F.Fab)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 8 IO11))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 7 IO10))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 18 GND))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 24 IN0P))
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 54 OUT0))
(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 20 +5VA))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56392BF8)
routed some more.
2015-11-17 16:48:00 +00:00
(at 212.935877 72.787513)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A3854)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference U2 (at 0 -3.5) (layer F.SilkS)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value ADuM1201WT (at 0 3.5) (layer F.Fab)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 10 IO13))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 9 IO12))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 18 GND))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 25 IN1P))
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 55 OUT1))
(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 20 +5VA))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56392C04)
routed some more.
2015-11-17 16:48:00 +00:00
(at 212.935877 66.787513)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A384E)
(attr smd)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text reference U3 (at 0 -3.5) (layer F.SilkS)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
routed some more.
2015-11-17 16:48:00 +00:00
(fp_text value ADuM1201WT (at 0 3.5) (layer F.Fab)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 19 +5V))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 12 IO15))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 11 IO14))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 18 GND))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 26 IN2P))
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 56 OUT2))
(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(net 20 +5VA))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 90))
)
(model smd/smd_dil/so-8.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 90))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56393A31)
(at 155.04 77.298 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A36DC)
(attr smd)
(fp_text reference U4 (at 0 -3.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ADuM1201WT (at 0 3.5 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 19 +5V))
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 17 IO7))
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 4 IO6))
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 18 GND))
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 142 GND3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 44 3TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 43 3RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 141 5V3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56393A3D)
(at 149.039999 77.298001 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A36D6)
(attr smd)
(fp_text reference U5 (at 0 -3.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ADuM1201WT (at 0 3.5 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 19 +5V))
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 6 IO9))
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 5 IO8))
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 18 GND))
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 144 GND4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 48 4TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 47 4RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 143 5V4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56393C2F)
(at 173.04 77.298 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /56394653)
(attr smd)
(fp_text reference U6 (at 0 -3.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ADuM1201WT (at 0 3.5 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 19 +5V))
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 14 IO1))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 1 IO0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 18 GND))
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 136 GND0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 28 0TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 27 0RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 135 5V0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56393C3A)
(at 167.04 77.297999 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563945E9)
(attr smd)
(fp_text reference U7 (at 0 -3.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ADuM1201WT (at 0 3.5 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 19 +5V))
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 15 IO3))
routed some more.
2015-11-17 16:48:00 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 2 IO2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 18 GND))
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 138 GND1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 32 1TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 31 1RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 137 5V1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 56393C45)
(at 161.04 77.298 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /5639453C)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U8 (at 0 -3.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
Latest changes.
2015-11-08 15:13:56 +00:00
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1201WT (at 0 3.5 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
Latest changes.
2015-11-08 15:13:56 +00:00
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 19 +5V))
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 16 IO5))
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 IO4))
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 18 GND))
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 140 GND2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 40 2TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 39 2RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 139 5V2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
Latest changes.
2015-11-08 15:13:56 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563A801C)
(at 173.040001 66.124 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563AA72F)
Latest changes.
2015-11-08 15:13:56 +00:00
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference P1 (at 0 -3.5 90) (layer F.SilkS)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(effects (font (size 1 1) (thickness 0.15)))
Latest changes.
2015-11-08 15:13:56 +00:00
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL8 (at 0 3.5 90) (layer F.Fab)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(effects (font (size 1 1) (thickness 0.15)))
Latest changes.
2015-11-08 15:13:56 +00:00
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 135 5V0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 27 0RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 28 0TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 136 GND0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 108 0TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 107 0TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 30 0RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 29 0RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
Latest changes.
2015-11-08 15:13:56 +00:00
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563A8028)
(at 167.04 66.124 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A8871)
(attr smd)
(fp_text reference P2 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL8 (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 137 5V1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 31 1RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 32 1TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 138 GND1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 120 1TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 119 1TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 34 1RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 33 1RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
Latest changes.
2015-11-08 15:13:56 +00:00
(at (xyz 0 0 0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(scale (xyz 1 1 1))
Latest changes.
2015-11-08 15:13:56 +00:00
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563A803E)
(at 161.04 66.124 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563AA0A9)
(attr smd)
(fp_text reference P4 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL8 (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 139 5V2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 39 2RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 40 2TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 140 GND2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 112 2TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 111 2TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 42 2RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 41 2RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
Latest changes.
2015-11-08 15:13:56 +00:00
(at (xyz 0 0 0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(scale (xyz 1 1 1))
Latest changes.
2015-11-08 15:13:56 +00:00
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563A804A)
(at 155.040001 66.124 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563AA173)
(attr smd)
(fp_text reference P5 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL8 (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 141 5V3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 43 3RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 44 3TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 142 GND3))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 124 3TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 123 3TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 46 3RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 45 3RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
Latest changes.
2015-11-08 15:13:56 +00:00
(at (xyz 0 0 0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(scale (xyz 1 1 1))
Latest changes.
2015-11-08 15:13:56 +00:00
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563A8056)
(at 149.04 66.124 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563AA4D3)
(attr smd)
(fp_text reference P6 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL8 (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 143 5V4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 47 4RX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 48 4TX))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(net 144 GND4))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 116 4TX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 115 4TX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 50 4RX-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 49 4RX+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
Latest changes.
2015-11-08 15:13:56 +00:00
(at (xyz 0 0 0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(scale (xyz 1 1 1))
Latest changes.
2015-11-08 15:13:56 +00:00
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-16_3.9x9.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D43FD)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 221.488 119.888 270)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D8003)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference P7 (at 0 -6 270) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL16 (at 0 6 270) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.7 -5.25) (end -3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.7 -5.25) (end 3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 -5.25) (end 3.7 -5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 5.25) (end 3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -5.075) (end -2.075 -4.97) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -5.075) (end 2.075 -4.97) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 5.075) (end 2.075 4.97) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 5.075) (end -2.075 4.97) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -5.075) (end 2.075 -5.075) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 5.075) (end 2.075 5.075) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -4.97) (end -3.45 -4.97) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 72 ENC0Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 73 ENC0Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 -1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 94 ENC0Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 -0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
Finished routing the encoder side. Power supply needs to be designed and SSerial side needs sockets.
2015-11-08 17:08:40 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at -2.7 0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 101 ENC1Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at -2.7 1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 79 ENC1Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at -2.7 3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 78 ENC1Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at -2.7 4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 9 smd rect (at 2.7 4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 70 ENC0A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 10 smd rect (at 2.7 3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 69 ENC0A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 11 smd rect (at 2.7 1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 93 ENC0A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 12 smd rect (at 2.7 0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 13 smd rect (at 2.7 -0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 97 ENC0B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 14 smd rect (at 2.7 -1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 71 ENC0B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 15 smd rect (at 2.7 -3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 74 ENC0B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 16 smd rect (at 2.7 -4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
(model Housings_SOIC.3dshapes/SOIC-16_3.9x9.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-16_3.9x9.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D4411)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 204.978 120.142 270)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D7F7B)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference P8 (at 0 -6 270) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL16 (at 0 6 270) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.7 -5.25) (end -3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.7 -5.25) (end 3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 -5.25) (end 3.7 -5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 5.25) (end 3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -5.075) (end -2.075 -4.97) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -5.075) (end 2.075 -4.97) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 5.075) (end 2.075 4.97) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 5.075) (end -2.075 4.97) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -5.075) (end 2.075 -5.075) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 5.075) (end 2.075 5.075) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -4.97) (end -3.45 -4.97) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 86 ENC2B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 83 ENC2B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 -1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 99 ENC2B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 -0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at -2.7 0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 102 ENC2Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at -2.7 1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 85 ENC2Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at -2.7 3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 84 ENC2Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at -2.7 4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 9 smd rect (at 2.7 4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 80 ENC1B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 10 smd rect (at 2.7 3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 77 ENC1B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 11 smd rect (at 2.7 1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 98 ENC1B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 12 smd rect (at 2.7 0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 13 smd rect (at 2.7 -0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 95 ENC1A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 14 smd rect (at 2.7 -1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 75 ENC1A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 15 smd rect (at 2.7 -3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 76 ENC1A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 16 smd rect (at 2.7 -4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
(model Housings_SOIC.3dshapes/SOIC-16_3.9x9.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-16_3.9x9.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D4425)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 188.722 120.142 270)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D7EC4)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference P9 (at 0 -6 270) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value DIL16 (at 0 6 270) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.7 -5.25) (end -3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.7 -5.25) (end 3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 -5.25) (end 3.7 -5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 5.25) (end 3.7 5.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -5.075) (end -2.075 -4.97) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -5.075) (end 2.075 -4.97) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 5.075) (end 2.075 4.97) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 5.075) (end -2.075 4.97) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -5.075) (end 2.075 -5.075) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 5.075) (end 2.075 5.075) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -4.97) (end -3.45 -4.97) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 90 ENC3Z-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 91 ENC3Z+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 -1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 103 ENC3Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 -0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at -2.7 0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 105 ENC3A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at -2.7 1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 87 ENC3A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at -2.7 3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 88 ENC3A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at -2.7 4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 9 smd rect (at 2.7 4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 92 ENC3B-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 10 smd rect (at 2.7 3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 89 ENC3B+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 11 smd rect (at 2.7 1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 104 ENC3B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 12 smd rect (at 2.7 0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 13 smd rect (at 2.7 -0.635 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 100 ENC2A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 14 smd rect (at 2.7 -1.905 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 81 ENC2A+))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 15 smd rect (at 2.7 -3.175 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 82 ENC2A-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 16 smd rect (at 2.7 -4.445 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
(model Housings_SOIC.3dshapes/SOIC-16_3.9x9.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D4431)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 220.34 104.662 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D3EDA)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U9 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1200CR (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 93 ENC0A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 97 ENC0B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 65 ENC0BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 57 ENC0AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D443D)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 214.34 104.662 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D3E9D)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U10 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1200CR (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 101 ENC1Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 94 ENC0Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 58 ENC0ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 67 ENC1ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D4449)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 208.34 104.662 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D3E41)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U11 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1200CR (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 98 ENC1B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 95 ENC1A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 66 ENC1AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 59 ENC1BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D4455)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 202.34 104.662 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D3F0E)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U12 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1200CR (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 102 ENC2Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 99 ENC2B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 68 ENC2BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 61 ENC2ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D4461)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 196.34 104.662 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D867A)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U13 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1200CR (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 104 ENC3B))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 100 ENC2A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 60 ENC2AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 63 ENC3BO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 563D446D)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(at 190.34 104.662 90)
Latest changes.
2015-11-08 15:13:56 +00:00
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /563A2AF8/563D87C6)
(attr smd)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text reference U14 (at 0 -3.5 90) (layer F.SilkS)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fp_text value ADuM1200CR (at 0 3.5 90) (layer F.Fab)
Latest changes.
2015-11-08 15:13:56 +00:00
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 20 +5VA))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 105 ENC3A))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 103 ENC3Z))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 18 GND))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 64 ENC3ZO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
routed some more.
2015-11-17 16:48:00 +00:00
(net 62 ENC3AO))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
Latest changes.
2015-11-08 15:13:56 +00:00
(net 19 +5V))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(module Sockets_WAGO734:WAGO_734_2pin_Straight_RuggedPads (layer F.Cu) (tedit 0) (tstamp 563FE2B6)
Major routing done
2015-11-22 00:17:10 +00:00
(at 236.982 95.27794 90)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(descr "WAGO, Serie 734, Socket, Stiftleiste, 2 polig, 2 pin, rugged Pads, straight, gerade, Date 05Jul2010,")
(tags "WAGO, Serie 734, Socket, Stiftleiste, 2 polig, 2 pin, rugged Pads, straight, gerade, Date 05Jul2010,")
(path /5640E11C)
(fp_text reference P10 (at 0 -6.35 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_2 (at 0 6.35 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -4.7498 -2.25044) (end 4.7498 -2.25044) (layer F.SilkS) (width 0.15))
(fp_line (start 0.24892 4.24942) (end 0.24892 2.25044) (layer F.SilkS) (width 0.15))
(fp_line (start 0.24892 2.25044) (end 1.75006 2.25044) (layer F.SilkS) (width 0.15))
(fp_line (start 1.75006 2.25044) (end 1.75006 4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -4.7498 2.25044) (end -1.75006 2.25044) (layer F.SilkS) (width 0.15))
(fp_line (start -1.75006 2.25044) (end -1.75006 4.20116) (layer F.SilkS) (width 0.15))
(fp_line (start 4.7498 4.24942) (end 4.7498 -4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start 4.7498 -4.24942) (end -4.7498 -4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -4.7498 -4.24942) (end -4.7498 4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -4.7498 4.24942) (end 4.7498 4.24942) (layer F.SilkS) (width 0.15))
(pad 2 thru_hole oval (at 1.75006 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 126 +24V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 thru_hole oval (at -1.75006 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
)
(module Sockets_WAGO734:WAGO_734_6pin_Straight_RuggedPads (layer F.Cu) (tedit 0) (tstamp 563FEDF6)
(at 236.982 78.51394 90)
(descr "WAGO, Serie 734, Socket, Stiftleiste, 6 polig, 6 pin, rugged Pads, straight, gerade, Date 05Jul2010,")
(tags "WAGO, Serie 734, Socket, Stiftleiste, 6 polig, 6 pin, rugged Pads, straight, gerade, Date 05Jul2010,")
(path /564210DC)
(fp_text reference P11 (at 0 -6.35 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_6 (at 0 6.35 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -11.75004 -2.4511) (end 11.75004 -2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start 8.7503 4.24942) (end 8.7503 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start 8.7503 2.4511) (end -7.24916 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start -7.24916 4.24942) (end -7.24916 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start -11.75004 2.4511) (end -9.25068 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start -9.25068 2.4511) (end -9.25068 4.20116) (layer F.SilkS) (width 0.15))
(fp_line (start 0 4.24942) (end 11.75004 4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start 11.75004 4.24942) (end 11.75004 -4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start 11.75004 -4.24942) (end -11.75004 -4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -11.75004 -4.24942) (end -11.75004 4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -11.75004 4.24942) (end 0 4.24942) (layer F.SilkS) (width 0.15))
(pad 3 thru_hole oval (at -1.75006 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 52 IN1))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole oval (at -5.25018 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole oval (at 1.75006 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole oval (at 5.25018 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 53 IN2))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 thru_hole oval (at -8.7503 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 51 IN0))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole oval (at 8.7503 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 96 EN-))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
)
(module Sockets_WAGO734:WAGO_734_6pin_Straight_RuggedPads (layer F.Cu) (tedit 0) (tstamp 563FF245)
(at 236.982 54.216299 90)
(descr "WAGO, Serie 734, Socket, Stiftleiste, 6 polig, 6 pin, rugged Pads, straight, gerade, Date 05Jul2010,")
(tags "WAGO, Serie 734, Socket, Stiftleiste, 6 polig, 6 pin, rugged Pads, straight, gerade, Date 05Jul2010,")
(path /5642124C)
(fp_text reference P13 (at 0 -6.35 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_6 (at 0 6.35 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -11.75004 -2.4511) (end 11.75004 -2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start 8.7503 4.24942) (end 8.7503 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start 8.7503 2.4511) (end -7.24916 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start -7.24916 4.24942) (end -7.24916 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start -11.75004 2.4511) (end -9.25068 2.4511) (layer F.SilkS) (width 0.15))
(fp_line (start -9.25068 2.4511) (end -9.25068 4.20116) (layer F.SilkS) (width 0.15))
(fp_line (start 0 4.24942) (end 11.75004 4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start 11.75004 4.24942) (end 11.75004 -4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start 11.75004 -4.24942) (end -11.75004 -4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -11.75004 -4.24942) (end -11.75004 4.24942) (layer F.SilkS) (width 0.15))
(fp_line (start -11.75004 4.24942) (end 0 4.24942) (layer F.SilkS) (width 0.15))
(pad 3 thru_hole oval (at -1.75006 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 128 OUT1FET))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 2 thru_hole oval (at -5.25018 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 126 +24V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 4 thru_hole oval (at 1.75006 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 126 +24V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 5 thru_hole oval (at 5.25018 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 129 OUT2FET))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 1 thru_hole oval (at -8.7503 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 127 OUT0FET))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(pad 6 thru_hole oval (at 8.7503 0 90) (size 1.99898 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
routed some more.
2015-11-17 16:48:00 +00:00
(net 126 +24V))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
)
Major routing done
2015-11-22 00:17:10 +00:00
(module LEDs:LED-0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 5651009D)
(at 219.984897 62.287513)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /563A5274)
(attr smd)
(fp_text reference D1 (at 0 -1.75) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value LED (at 0 1.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 0.75) (end 1.1 0.75) (layer F.SilkS) (width 0.15))
(fp_line (start -1.6 -0.75) (end 1.1 -0.75) (layer F.SilkS) (width 0.15))
(fp_line (start -0.1 0.15) (end -0.1 -0.1) (layer F.SilkS) (width 0.15))
(fp_line (start -0.1 -0.1) (end -0.25 0.05) (layer F.SilkS) (width 0.15))
(fp_line (start -0.35 -0.35) (end -0.35 0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 0) (end 0.35 0) (layer F.SilkS) (width 0.15))
(fp_line (start -0.35 0) (end 0 -0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 -0.35) (end 0 0.35) (layer F.SilkS) (width 0.15))
(fp_line (start 0 0.35) (end -0.35 0) (layer F.SilkS) (width 0.15))
(fp_line (start 1.9 -0.95) (end 1.9 0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.9 0.95) (end -1.9 0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 0.95) (end -1.9 -0.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 -0.95) (end 1.9 -0.95) (layer F.CrtYd) (width 0.05))
(pad 2 smd rect (at 1.04902 0 180) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 1 smd rect (at -1.04902 0 180) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
(net 21 "Net-(D1-Pad1)"))
(model LEDs.3dshapes/LED-0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Final version.
2015-11-29 23:35:28 +00:00
(module Socket_Strips:Socket_Strip_Straight_1x07 (layer F.Cu) (tedit 0) (tstamp 565B8B0B)
(at 174.244 115.697 90)
(descr "Through hole socket strip")
(tags "socket strip")
(path /563A2AF8/565BA284)
(fp_text reference P12 (at 0 -5.1 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_7 (at 0 -3.1 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.75 -1.75) (end -1.75 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 17 -1.75) (end 17 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.75 -1.75) (end 17 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.75 1.75) (end 17 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.27 1.27) (end 16.51 1.27) (layer F.SilkS) (width 0.15))
(fp_line (start 16.51 1.27) (end 16.51 -1.27) (layer F.SilkS) (width 0.15))
(fp_line (start 16.51 -1.27) (end 1.27 -1.27) (layer F.SilkS) (width 0.15))
(fp_line (start -1.55 1.55) (end 0 1.55) (layer F.SilkS) (width 0.15))
(fp_line (start 1.27 1.27) (end 1.27 -1.27) (layer F.SilkS) (width 0.15))
(fp_line (start 0 -1.55) (end -1.55 -1.55) (layer F.SilkS) (width 0.15))
(fp_line (start -1.55 -1.55) (end -1.55 1.55) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole rect (at 0 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 19 +5V))
(pad 2 thru_hole oval (at 2.54 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 130 "Net-(J2-Pad1)"))
(pad 3 thru_hole oval (at 5.08 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 133 "Net-(J2-Pad14)"))
(pad 4 thru_hole oval (at 7.62 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 131 "Net-(J2-Pad2)"))
(pad 5 thru_hole oval (at 10.16 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 134 "Net-(J2-Pad15)"))
(pad 6 thru_hole oval (at 12.7 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 132 "Net-(J2-Pad3)"))
(pad 7 thru_hole oval (at 15.24 0 90) (size 1.7272 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
(net 18 GND))
(model Socket_Strips.3dshapes/Socket_Strip_Straight_1x07.wrl
(at (xyz 0.3 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 180))
Major routing done
2015-11-22 00:17:10 +00:00
)
)
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(module Fiducials:Fiducial_1mm_Dia_2.54mm_Outer_CopperTop (layer F.Cu) (tedit 565CB715) (tstamp 565CB6F5)
(at 179.07 68.834)
(descr "Circular Fiducial, 1mm bare copper top; 2.54mm keepout")
(tags marker)
(attr virtual)
(fp_text reference REF** (at 3.4 0.7) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Fiducial_1mm_Dia_2.54mm_Outer_CopperTop (at 0 -1.8) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 1.55 0) (layer F.CrtYd) (width 0.05))
(pad ~ smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
(solder_mask_margin 0.77) (clearance 0.77))
)
(module Fiducials:Fiducial_1mm_Dia_2.54mm_Outer_CopperBottom (layer F.Cu) (tedit 565CB72C) (tstamp 565CB726)
(at 187.452 81.915)
(descr "Circular Fiducial, 1mm bare copper bottom; 2.54mm keepout")
(tags marker)
(attr virtual)
(fp_text reference REF** (at 3.4 0.7) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Fiducial_1mm_Dia_2.54mm_Outer_CopperBottom (at 0 -1.8) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 1.55 0) (layer B.CrtYd) (width 0.05))
(pad ~ smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
(solder_mask_margin 0.77) (clearance 0.77))
)
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(module Diodes_SMD:MiniMELF_Standard (layer F.Cu) (tedit 55364937) (tstamp 565CDABC)
(at 230.648 60.579)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /565D8D3E)
(attr smd)
(fp_text reference D4 (at 0 -1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_text value DIODE (at 0 3) (layer F.Fab)
(effects (font (size 1 1)))
)
(fp_line (start -2 -1) (end 2 -1) (layer F.CrtYd) (width 0))
(fp_line (start 2 -1) (end 2 1) (layer F.CrtYd) (width 0))
(fp_line (start 2 1) (end -2 1) (layer F.CrtYd) (width 0))
(fp_line (start -2 1) (end -2 -1) (layer F.CrtYd) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_text user K (at -1 1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_text user A (at 1 1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_circle (center 0 0) (end 0 0) (layer F.Adhes) (width 0))
(fp_circle (center 0 0) (end 0 0) (layer F.Adhes) (width 0))
(pad 1 smd rect (at -1 0) (size 1 1) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 2 smd rect (at 1 0) (size 1 1) (layers F.Cu F.Paste F.Mask)
(net 127 OUT0FET))
(model Diodes_SMD.3dshapes/MiniMELF_Standard.wrl
(at (xyz 0 0 0))
(scale (xyz 0 0 0))
(rotate (xyz 0 0 0))
)
)
(module Diodes_SMD:MiniMELF_Standard (layer F.Cu) (tedit 55364937) (tstamp 565CDAC2)
(at 230.648 53.594)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /565D8EC8)
(attr smd)
(fp_text reference D5 (at 0 -1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_text value DIODE (at 0 3) (layer F.Fab)
(effects (font (size 1 1)))
)
(fp_line (start -2 -1) (end 2 -1) (layer F.CrtYd) (width 0))
(fp_line (start 2 -1) (end 2 1) (layer F.CrtYd) (width 0))
(fp_line (start 2 1) (end -2 1) (layer F.CrtYd) (width 0))
(fp_line (start -2 1) (end -2 -1) (layer F.CrtYd) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_text user K (at -1 1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_text user A (at 1 1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_circle (center 0 0) (end 0 0) (layer F.Adhes) (width 0))
(fp_circle (center 0 0) (end 0 0) (layer F.Adhes) (width 0))
(pad 1 smd rect (at -1 0) (size 1 1) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 2 smd rect (at 1 0) (size 1 1) (layers F.Cu F.Paste F.Mask)
(net 128 OUT1FET))
(model Diodes_SMD.3dshapes/MiniMELF_Standard.wrl
(at (xyz 0 0 0))
(scale (xyz 0 0 0))
(rotate (xyz 0 0 0))
)
)
(module Diodes_SMD:MiniMELF_Standard (layer F.Cu) (tedit 55364937) (tstamp 565CDAC8)
(at 230.616 51.943)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /565D8FAE)
(attr smd)
(fp_text reference D6 (at 0 -1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_text value DIODE (at 0 3) (layer F.Fab)
(effects (font (size 1 1)))
)
(fp_line (start -2 -1) (end 2 -1) (layer F.CrtYd) (width 0))
(fp_line (start 2 -1) (end 2 1) (layer F.CrtYd) (width 0))
(fp_line (start 2 1) (end -2 1) (layer F.CrtYd) (width 0))
(fp_line (start -2 1) (end -2 -1) (layer F.CrtYd) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_line (start 0 0) (end 0 0) (layer F.SilkS) (width 0))
(fp_text user K (at -1 1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_text user A (at 1 1) (layer F.SilkS)
(effects (font (size 1 1)))
)
(fp_circle (center 0 0) (end 0 0) (layer F.Adhes) (width 0))
(fp_circle (center 0 0) (end 0 0) (layer F.Adhes) (width 0))
(pad 1 smd rect (at -1 0) (size 1 1) (layers F.Cu F.Paste F.Mask)
(net 96 EN-))
(pad 2 smd rect (at 1 0) (size 1 1) (layers F.Cu F.Paste F.Mask)
(net 129 OUT2FET))
(model Diodes_SMD.3dshapes/MiniMELF_Standard.wrl
(at (xyz 0 0 0))
(scale (xyz 0 0 0))
(rotate (xyz 0 0 0))
)
)
Final version.
2015-11-29 23:35:28 +00:00
(gr_text :3 (at 184.277 83.439) (layer B.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
)
(gr_text "BOB\nSTMBL Breakout Board\nV0.0.1" (at 195.961 89.281) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(gr_line (start 141.986 42.164) (end 141.986 141.986) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 241.808 42.164) (end 141.986 42.164) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 241.808 141.986) (end 241.808 42.164) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 141.986 141.986) (end 241.808 141.986) (angle 90) (layer Edge.Cuts) (width 0.15))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 154.710088 94.950436) (end 154.710088 115.180274) (width 0.25) (layer F.Cu) (net 1))
(segment (start 173.675 79.998) (end 173.675 84.799695) (width 0.25) (layer F.Cu) (net 1))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 164.110064 92.175936) (end 157.484588 92.175936) (width 0.25) (layer F.Cu) (net 1))
(segment (start 173.675 84.799695) (end 171.060706 87.413989) (width 0.25) (layer F.Cu) (net 1))
(segment (start 171.060706 87.413989) (end 168.872011 87.413989) (width 0.25) (layer F.Cu) (net 1))
(segment (start 168.872011 87.413989) (end 164.110064 92.175936) (width 0.25) (layer F.Cu) (net 1))
(segment (start 157.484588 92.175936) (end 154.710088 94.950436) (width 0.25) (layer F.Cu) (net 1))
(segment (start 154.710088 115.180274) (end 149.957362 119.933) (width 0.25) (layer F.Cu) (net 1))
(segment (start 149.957362 119.933) (end 148.12663 119.933) (width 0.25) (layer F.Cu) (net 1))
(segment (start 148.12663 119.933) (end 147.049 119.933) (width 0.25) (layer F.Cu) (net 1))
(segment (start 160.428272 86.303034) (end 160.117306 86.614) (width 0.25) (layer F.Cu) (net 2))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 150.604999 114.980001) (end 149.843 115.742) (width 0.25) (layer F.Cu) (net 2))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 153.770067 111.814933) (end 150.604999 114.980001) (width 0.25) (layer F.Cu) (net 2))
(segment (start 153.770067 88.897238) (end 153.770067 111.814933) (width 0.25) (layer F.Cu) (net 2))
(segment (start 156.053305 86.614) (end 153.770067 88.897238) (width 0.25) (layer F.Cu) (net 2))
(segment (start 160.117306 86.614) (end 156.053305 86.614) (width 0.25) (layer F.Cu) (net 2))
(segment (start 166.840011 86.143989) (end 161.059098 86.143989) (width 0.25) (layer F.Cu) (net 2))
(segment (start 167.675 85.309) (end 166.840011 86.143989) (width 0.25) (layer F.Cu) (net 2))
(segment (start 160.900053 86.303034) (end 160.428272 86.303034) (width 0.25) (layer F.Cu) (net 2))
(segment (start 167.675 79.997999) (end 167.675 85.309) (width 0.25) (layer F.Cu) (net 2))
(segment (start 161.059098 86.143989) (end 160.900053 86.303034) (width 0.25) (layer F.Cu) (net 2))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 152.830045 107.166955) (end 150.604999 109.392001) (width 0.25) (layer F.Cu) (net 3))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 155.701926 85.635989) (end 152.830045 88.50787) (width 0.25) (layer F.Cu) (net 3))
(segment (start 160.038903 85.363012) (end 159.765926 85.635989) (width 0.25) (layer F.Cu) (net 3))
(segment (start 160.510685 85.363012) (end 160.038903 85.363012) (width 0.25) (layer F.Cu) (net 3))
(segment (start 161.675 79.998) (end 161.675 84.198697) (width 0.25) (layer F.Cu) (net 3))
(segment (start 159.765926 85.635989) (end 155.701926 85.635989) (width 0.25) (layer F.Cu) (net 3))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 150.604999 109.392001) (end 149.843 110.154) (width 0.25) (layer F.Cu) (net 3))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 152.830045 88.50787) (end 152.830045 107.166955) (width 0.25) (layer F.Cu) (net 3))
(segment (start 161.675 84.198697) (end 160.510685 85.363012) (width 0.25) (layer F.Cu) (net 3))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 151.890023 102.518977) (end 151.890023 88.118502) (width 0.25) (layer F.Cu) (net 4))
(segment (start 155.675 81.023) (end 155.675 79.998) (width 0.25) (layer F.Cu) (net 4))
(segment (start 155.675 84.333525) (end 155.675 81.023) (width 0.25) (layer F.Cu) (net 4))
(segment (start 151.890023 88.118502) (end 155.675 84.333525) (width 0.25) (layer F.Cu) (net 4))
(segment (start 149.843 104.566) (end 151.890023 102.518977) (width 0.25) (layer F.Cu) (net 4))
(segment (start 149.843 99.105) (end 150.950001 97.997999) (width 0.25) (layer F.Cu) (net 5))
(segment (start 150.950001 97.997999) (end 150.950001 86.079003) (width 0.25) (layer F.Cu) (net 5))
(segment (start 150.950001 86.079003) (end 149.674999 84.804001) (width 0.25) (layer F.Cu) (net 5))
(segment (start 149.674999 84.804001) (end 149.674999 81.023001) (width 0.25) (layer F.Cu) (net 5))
(segment (start 149.674999 81.023001) (end 149.674999 79.998001) (width 0.25) (layer F.Cu) (net 5))
(segment (start 149.843 96.311) (end 149.843 92.727) (width 0.25) (layer F.Cu) (net 6))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 149.843 92.727) (end 149.064 91.948) (width 0.25) (layer F.Cu) (net 6))
(segment (start 149.064 91.948) (end 147.066 91.948) (width 0.25) (layer F.Cu) (net 6))
(segment (start 147.066 91.948) (end 145.542 90.424) (width 0.25) (layer F.Cu) (net 6))
(segment (start 147.611002 85.598) (end 148.385001 84.824001) (width 0.25) (layer F.Cu) (net 6))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 145.542 90.424) (end 145.542 87.061694) (width 0.25) (layer F.Cu) (net 6))
(segment (start 145.542 87.061694) (end 147.005694 85.598) (width 0.25) (layer F.Cu) (net 6))
(segment (start 147.005694 85.598) (end 147.611002 85.598) (width 0.25) (layer F.Cu) (net 6))
(segment (start 148.385001 84.218693) (end 148.404999 84.198695) (width 0.25) (layer F.Cu) (net 6))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 148.385001 84.824001) (end 148.385001 84.218693) (width 0.25) (layer F.Cu) (net 6))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 148.404999 84.198695) (end 148.404999 79.998001) (width 0.25) (layer F.Cu) (net 6))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 200.914 90.424) (end 169.85017 90.424) (width 0.25) (layer F.Cu) (net 7))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 157.530154 96.469846) (end 157.530154 122.28054) (width 0.25) (layer F.Cu) (net 7))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 165.278168 94.996002) (end 159.003998 94.996002) (width 0.25) (layer F.Cu) (net 7))
(segment (start 204.47 86.868) (end 200.914 90.424) (width 0.25) (layer F.Cu) (net 7))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 204.47 80.382388) (end 204.47 86.868) (width 0.25) (layer F.Cu) (net 7))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 210.235877 79.422513) (end 205.429875 79.422513) (width 0.25) (layer F.Cu) (net 7))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 157.530154 122.28054) (end 151.622694 128.188) (width 0.25) (layer F.Cu) (net 7))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 169.85017 90.424) (end 165.278168 94.996002) (width 0.25) (layer F.Cu) (net 7))
(segment (start 151.622694 128.188) (end 148.12663 128.188) (width 0.25) (layer F.Cu) (net 7))
(segment (start 148.12663 128.188) (end 147.049 128.188) (width 0.25) (layer F.Cu) (net 7))
(segment (start 205.429875 79.422513) (end 204.47 80.382388) (width 0.25) (layer F.Cu) (net 7))
(segment (start 159.003998 94.996002) (end 157.530154 96.469846) (width 0.25) (layer F.Cu) (net 7))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 210.235877 79.422513) (end 209.760878 79.422513) (width 0.25) (layer F.Cu) (net 7))
(segment (start 150.92063 126.791) (end 149.843 126.791) (width 0.25) (layer F.Cu) (net 8))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 157.060143 120.651487) (end 150.92063 126.791) (width 0.25) (layer F.Cu) (net 8))
(segment (start 157.060143 95.923856) (end 157.060143 120.651487) (width 0.25) (layer F.Cu) (net 8))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 158.458008 94.525991) (end 157.060143 95.923856) (width 0.25) (layer F.Cu) (net 8))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 165.083484 94.525991) (end 158.458008 94.525991) (width 0.25) (layer F.Cu) (net 8))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 204.549487 78.152513) (end 203.962 78.74) (width 0.25) (layer F.Cu) (net 8))
(segment (start 203.962 78.74) (end 203.962 86.614) (width 0.25) (layer F.Cu) (net 8))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 210.235877 78.152513) (end 204.549487 78.152513) (width 0.25) (layer F.Cu) (net 8))
(segment (start 169.731464 89.87801) (end 165.083484 94.525991) (width 0.25) (layer F.Cu) (net 8))
(segment (start 200.69799 89.87801) (end 169.731464 89.87801) (width 0.25) (layer F.Cu) (net 8))
(segment (start 203.962 86.614) (end 200.69799 89.87801) (width 0.25) (layer F.Cu) (net 8))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 200.876011 88.683989) (end 200.914 88.646) (width 0.25) (layer F.Cu) (net 9))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 164.8888 94.05598) (end 169.536781 89.407999) (width 0.25) (layer F.Cu) (net 9))
(segment (start 158.263324 94.05598) (end 164.8888 94.05598) (width 0.25) (layer F.Cu) (net 9))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 156.590132 95.729172) (end 158.263324 94.05598) (width 0.25) (layer F.Cu) (net 9))
(segment (start 147.049 125.394) (end 151.212 125.394) (width 0.25) (layer F.Cu) (net 9))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 169.536781 89.407999) (end 200.152001 89.407999) (width 0.25) (layer F.Cu) (net 9))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 151.212 125.394) (end 156.590132 120.015868) (width 0.25) (layer F.Cu) (net 9))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 156.590132 120.015868) (end 156.590132 95.729172) (width 0.25) (layer F.Cu) (net 9))
(segment (start 200.152001 89.407999) (end 200.876011 88.683989) (width 0.25) (layer F.Cu) (net 9))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 203.454 86.106) (end 200.914 88.646) (width 0.25) (layer F.Cu) (net 9))
(segment (start 200.914 88.646) (end 200.66 88.9) (width 0.25) (layer F.Cu) (net 9))
(segment (start 210.235877 73.422513) (end 204.453487 73.422513) (width 0.25) (layer F.Cu) (net 9))
(segment (start 204.453487 73.422513) (end 203.454 74.422) (width 0.25) (layer F.Cu) (net 9))
(segment (start 203.454 74.422) (end 203.454 86.106) (width 0.25) (layer F.Cu) (net 9))
(segment (start 209.210877 72.152513) (end 210.235877 72.152513) (width 0.25) (layer F.Cu) (net 10))
(segment (start 149.843 123.997) (end 156.120121 117.719879) (width 0.25) (layer F.Cu) (net 10))
(segment (start 202.946 73.152) (end 203.945487 72.152513) (width 0.25) (layer F.Cu) (net 10))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 169.380084 88.9) (end 199.644 88.9) (width 0.25) (layer F.Cu) (net 10))
(segment (start 164.694116 93.585969) (end 169.380084 88.9) (width 0.25) (layer F.Cu) (net 10))
(segment (start 156.120121 117.719879) (end 156.120121 95.534488) (width 0.25) (layer F.Cu) (net 10))
(segment (start 203.945487 72.152513) (end 209.210877 72.152513) (width 0.25) (layer F.Cu) (net 10))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 199.644 88.9) (end 202.946 85.598) (width 0.25) (layer F.Cu) (net 10))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 156.120121 95.534488) (end 158.06864 93.585969) (width 0.25) (layer F.Cu) (net 10))
(segment (start 158.06864 93.585969) (end 164.694116 93.585969) (width 0.25) (layer F.Cu) (net 10))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 202.946 85.598) (end 202.946 73.152) (width 0.25) (layer F.Cu) (net 10))
(segment (start 149.929 124.083001) (end 149.842999 123.996998) (width 0.25) (layer F.Cu) (net 10))
(segment (start 155.65011 95.339804) (end 155.65011 117.14589) (width 0.25) (layer F.Cu) (net 11))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 169.22339 88.392) (end 164.499432 93.115958) (width 0.25) (layer F.Cu) (net 11))
(segment (start 164.499432 93.115958) (end 157.873956 93.115958) (width 0.25) (layer F.Cu) (net 11))
(segment (start 210.235877 67.422513) (end 203.722487 67.422513) (width 0.25) (layer F.Cu) (net 11))
(segment (start 148.12663 122.6) (end 147.049 122.6) (width 0.25) (layer F.Cu) (net 11))
(segment (start 155.65011 117.14589) (end 150.196 122.6) (width 0.25) (layer F.Cu) (net 11))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 202.438 85.344) (end 199.39 88.392) (width 0.25) (layer F.Cu) (net 11))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 203.722487 67.422513) (end 202.438 68.707) (width 0.25) (layer F.Cu) (net 11))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 157.873956 93.115958) (end 155.65011 95.339804) (width 0.25) (layer F.Cu) (net 11))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 150.196 122.6) (end 148.12663 122.6) (width 0.25) (layer F.Cu) (net 11))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 199.39 88.392) (end 169.22339 88.392) (width 0.25) (layer F.Cu) (net 11))
(segment (start 202.438 68.707) (end 202.438 85.344) (width 0.25) (layer F.Cu) (net 11))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 201.93 67.168513) (end 202.946 66.152513) (width 0.25) (layer F.Cu) (net 12))
(segment (start 209.210877 66.152513) (end 210.235877 66.152513) (width 0.25) (layer F.Cu) (net 12))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 202.946 66.152513) (end 209.210877 66.152513) (width 0.25) (layer F.Cu) (net 12))
(segment (start 169.066694 87.884) (end 198.882 87.884) (width 0.25) (layer F.Cu) (net 12))
(segment (start 164.304748 92.645947) (end 169.066694 87.884) (width 0.25) (layer F.Cu) (net 12))
(segment (start 155.180099 115.865901) (end 155.180099 95.14512) (width 0.25) (layer F.Cu) (net 12))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 149.843 121.203) (end 155.180099 115.865901) (width 0.25) (layer F.Cu) (net 12))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 155.180099 95.14512) (end 157.679272 92.645947) (width 0.25) (layer F.Cu) (net 12))
(segment (start 157.679272 92.645947) (end 164.304748 92.645947) (width 0.25) (layer F.Cu) (net 12))
(segment (start 201.93 84.836) (end 201.93 67.168513) (width 0.25) (layer F.Cu) (net 12))
(segment (start 198.882 87.884) (end 201.93 84.836) (width 0.25) (layer F.Cu) (net 12))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 149.843 129.585) (end 153.903 129.585) (width 0.25) (layer F.Cu) (net 13))
(segment (start 153.903 129.585) (end 153.924 129.606) (width 0.25) (layer F.Cu) (net 13))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 160.274 87.122) (end 160.31199 87.084011) (width 0.25) (layer F.Cu) (net 14))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 149.843 118.409) (end 154.240078 114.011922) (width 0.25) (layer F.Cu) (net 14))
(segment (start 154.240078 114.011922) (end 154.240078 89.091922) (width 0.25) (layer F.Cu) (net 14))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 154.240078 89.091922) (end 156.21 87.122) (width 0.25) (layer F.Cu) (net 14))
(segment (start 156.21 87.122) (end 160.274 87.122) (width 0.25) (layer F.Cu) (net 14))
(segment (start 160.31199 87.084011) (end 160.622956 86.773045) (width 0.25) (layer F.Cu) (net 14))
(segment (start 161.094737 86.773045) (end 161.253782 86.614) (width 0.25) (layer F.Cu) (net 14))
(segment (start 160.622956 86.773045) (end 161.094737 86.773045) (width 0.25) (layer F.Cu) (net 14))
(segment (start 161.253782 86.614) (end 171.196 86.614) (width 0.25) (layer F.Cu) (net 14))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 172.405 85.405) (end 172.405 81.023) (width 0.25) (layer F.Cu) (net 14))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 171.196 86.614) (end 172.405 85.405) (width 0.25) (layer F.Cu) (net 14))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 172.405 81.023) (end 172.405 79.998) (width 0.25) (layer F.Cu) (net 14))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 160.864414 85.673978) (end 166.532 85.673978) (width 0.25) (layer F.Cu) (net 15))
(segment (start 155.89661 86.106) (end 159.96061 86.106) (width 0.25) (layer F.Cu) (net 15))
(segment (start 166.405 80.472999) (end 166.405 79.997999) (width 0.25) (layer F.Cu) (net 15))
(segment (start 166.955 85.250978) (end 166.955 81.022999) (width 0.25) (layer F.Cu) (net 15))
(segment (start 166.532 85.673978) (end 166.955 85.250978) (width 0.25) (layer F.Cu) (net 15))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 153.300056 109.490944) (end 153.300056 88.702554) (width 0.25) (layer F.Cu) (net 15))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 153.300056 88.702554) (end 155.89661 86.106) (width 0.25) (layer F.Cu) (net 15))
(segment (start 166.955 81.022999) (end 166.405 80.472999) (width 0.25) (layer F.Cu) (net 15))
(segment (start 159.96061 86.106) (end 160.233588 85.833023) (width 0.25) (layer F.Cu) (net 15))
(segment (start 160.705369 85.833023) (end 160.864414 85.673978) (width 0.25) (layer F.Cu) (net 15))
(segment (start 160.233588 85.833023) (end 160.705369 85.833023) (width 0.25) (layer F.Cu) (net 15))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 149.843 112.948) (end 153.300056 109.490944) (width 0.25) (layer F.Cu) (net 15))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 160.405 84.71322) (end 160.405 81.023) (width 0.25) (layer F.Cu) (net 16))
(segment (start 159.844219 84.893001) (end 160.225219 84.893001) (width 0.25) (layer F.Cu) (net 16))
(segment (start 155.507242 85.165978) (end 159.571242 85.165978) (width 0.25) (layer F.Cu) (net 16))
(segment (start 159.571242 85.165978) (end 159.844219 84.893001) (width 0.25) (layer F.Cu) (net 16))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 160.405 81.023) (end 160.405 79.998) (width 0.25) (layer F.Cu) (net 16))
(segment (start 152.360034 104.842966) (end 152.360034 88.313186) (width 0.25) (layer F.Cu) (net 16))
(segment (start 152.360034 88.313186) (end 155.507242 85.165978) (width 0.25) (layer F.Cu) (net 16))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 149.843 107.36) (end 152.360034 104.842966) (width 0.25) (layer F.Cu) (net 16))
(segment (start 160.225219 84.893001) (end 160.405 84.71322) (width 0.25) (layer F.Cu) (net 16))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 154.405 84.93883) (end 154.405 81.023) (width 0.25) (layer F.Cu) (net 17))
(segment (start 151.420012 87.923818) (end 154.405 84.93883) (width 0.25) (layer F.Cu) (net 17))
(segment (start 151.420012 100.321988) (end 151.420012 87.923818) (width 0.25) (layer F.Cu) (net 17))
(segment (start 149.843 101.899) (end 151.420012 100.321988) (width 0.25) (layer F.Cu) (net 17))
(segment (start 154.405 81.023) (end 154.405 79.998) (width 0.25) (layer F.Cu) (net 17))
(segment (start 149.842999 101.898999) (end 149.995 101.898999) (width 0.25) (layer F.Cu) (net 17))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 203.835 96.266) (end 204.597 96.266) (width 0.25) (layer B.Cu) (net 18))
(segment (start 203.84 98.662) (end 203.84 96.271) (width 0.25) (layer F.Cu) (net 18))
(segment (start 203.84 96.271) (end 203.835 96.266) (width 0.25) (layer F.Cu) (net 18))
(via (at 203.835 96.266) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 162.54 84.798) (end 162.770958 85.028958) (width 0.25) (layer F.Cu) (net 18))
(segment (start 163.365264 85.028958) (end 162.941 85.028958) (width 0.25) (layer B.Cu) (net 18))
(segment (start 162.54 83.298) (end 162.54 84.798) (width 0.25) (layer F.Cu) (net 18))
(segment (start 163.768958 85.028958) (end 163.365264 85.028958) (width 0.25) (layer B.Cu) (net 18))
(segment (start 162.770958 85.028958) (end 162.941 85.028958) (width 0.25) (layer F.Cu) (net 18))
(segment (start 163.83 85.09) (end 163.768958 85.028958) (width 0.25) (layer B.Cu) (net 18))
(via (at 162.941 85.028958) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 207.370764 81.7245) (end 208.28 81.7245) (width 0.25) (layer B.Cu) (net 18))
(segment (start 206.9465 81.7245) (end 207.370764 81.7245) (width 0.25) (layer B.Cu) (net 18))
(segment (start 206.935877 80.287513) (end 206.935877 81.713877) (width 0.25) (layer F.Cu) (net 18))
(segment (start 206.935877 81.713877) (end 206.9465 81.7245) (width 0.25) (layer F.Cu) (net 18))
(via (at 206.9465 81.7245) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 204.724 74.422) (end 204.424001 74.721999) (width 0.25) (layer B.Cu) (net 18))
(segment (start 204.424001 74.721999) (end 204.424001 74.884001) (width 0.25) (layer B.Cu) (net 18))
(segment (start 206.935876 74.287514) (end 204.858486 74.287514) (width 0.25) (layer F.Cu) (net 18))
(via (at 204.724 74.422) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 204.858486 74.287514) (end 204.724 74.422) (width 0.25) (layer F.Cu) (net 18))
(segment (start 204.851 68.326) (end 204.426736 68.326) (width 0.25) (layer B.Cu) (net 18))
(segment (start 204.426736 68.326) (end 204.363236 68.2625) (width 0.25) (layer B.Cu) (net 18))
(segment (start 206.935877 68.287513) (end 204.889487 68.287513) (width 0.25) (layer F.Cu) (net 18))
(segment (start 204.889487 68.287513) (end 204.851 68.326) (width 0.25) (layer F.Cu) (net 18))
(via (at 204.851 68.326) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 191.7065 96.4565) (end 191.7065 95.9485) (width 0.25) (layer B.Cu) (net 18))
(segment (start 191.84 98.662) (end 191.84 96.59) (width 0.25) (layer F.Cu) (net 18))
(segment (start 191.84 96.59) (end 191.7065 96.4565) (width 0.25) (layer F.Cu) (net 18))
(via (at 191.7065 96.4565) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 197.8025 96.52) (end 197.8025 96.0755) (width 0.25) (layer B.Cu) (net 18))
(segment (start 197.84 98.662) (end 197.84 96.5575) (width 0.25) (layer F.Cu) (net 18))
(segment (start 197.84 96.5575) (end 197.8025 96.52) (width 0.25) (layer F.Cu) (net 18))
(via (at 197.8025 96.52) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 211.074 97.7265) (end 211.201 97.5995) (width 0.5) (layer B.Cu) (net 18))
(segment (start 209.84 98.662) (end 210.1385 98.662) (width 0.5) (layer F.Cu) (net 18))
(segment (start 210.1385 98.662) (end 211.074 97.7265) (width 0.5) (layer F.Cu) (net 18))
(via (at 211.074 97.7265) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 216.154 96.7105) (end 216.7255 96.7105) (width 0.5) (layer B.Cu) (net 18))
(segment (start 215.84 98.662) (end 215.84 97.0245) (width 0.5) (layer F.Cu) (net 18))
(segment (start 215.84 97.0245) (end 216.154 96.7105) (width 0.5) (layer F.Cu) (net 18))
(via (at 216.154 96.7105) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 221.8055 96.5835) (end 221.8055 96.159236) (width 0.5) (layer B.Cu) (net 18))
(segment (start 221.8055 96.159236) (end 221.825736 96.139) (width 0.5) (layer B.Cu) (net 18))
(segment (start 221.84 98.662) (end 221.84 96.618) (width 0.5) (layer F.Cu) (net 18))
(segment (start 221.84 96.618) (end 221.8055 96.5835) (width 0.5) (layer F.Cu) (net 18))
(via (at 221.8055 96.5835) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 153.924 137.033) (end 154.813 137.033) (width 0.25) (layer B.Cu) (net 18))
(segment (start 153.924 135.41502) (end 153.924 137.033) (width 0.25) (layer F.Cu) (net 18))
(via (at 153.924 137.033) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 151.638 83.312) (end 151.638 82.804) (width 0.25) (layer B.Cu) (net 18))
(segment (start 150.54 83.298) (end 151.624 83.298) (width 0.25) (layer F.Cu) (net 18))
(segment (start 151.624 83.298) (end 151.638 83.312) (width 0.25) (layer F.Cu) (net 18))
(via (at 151.638 83.312) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 157.734 83.312) (end 158.115 83.312) (width 0.25) (layer B.Cu) (net 18))
(segment (start 156.539999 83.298001) (end 157.720001 83.298001) (width 0.25) (layer F.Cu) (net 18))
(segment (start 157.720001 83.298001) (end 157.734 83.312) (width 0.25) (layer F.Cu) (net 18))
(via (at 157.734 83.312) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 168.529 85.725) (end 168.656 85.852) (width 0.25) (layer B.Cu) (net 18))
(segment (start 168.54 83.298) (end 168.54 85.714) (width 0.25) (layer F.Cu) (net 18))
(segment (start 168.54 85.714) (end 168.529 85.725) (width 0.25) (layer F.Cu) (net 18))
(via (at 168.529 85.725) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 174.625 85.725) (end 174.625 86.36) (width 0.25) (layer B.Cu) (net 18))
(segment (start 174.540001 83.298) (end 174.540001 85.640001) (width 0.25) (layer F.Cu) (net 18))
(segment (start 174.540001 85.640001) (end 174.625 85.725) (width 0.25) (layer F.Cu) (net 18))
(via (at 174.625 85.725) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
(segment (start 201.295 63.627) (end 200.995001 63.926999) (width 0.25) (layer B.Cu) (net 18))
(segment (start 200.995001 63.926999) (end 200.995001 64.053999) (width 0.25) (layer B.Cu) (net 18))
(segment (start 202.78598 63.119) (end 201.803 63.119) (width 0.25) (layer F.Cu) (net 18))
(segment (start 201.803 63.119) (end 201.295 63.627) (width 0.25) (layer F.Cu) (net 18))
(via (at 201.295 63.627) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 18))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 160.782 111.506) (end 160.782 108.712) (width 0.25) (layer F.Cu) (net 18))
(segment (start 160.782 114.3) (end 160.782 113.22237) (width 0.25) (layer F.Cu) (net 18))
(segment (start 160.782 113.22237) (end 160.782 111.506) (width 0.25) (layer F.Cu) (net 18))
(segment (start 160.782 117.094) (end 160.782 114.3) (width 0.25) (layer F.Cu) (net 18))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(segment (start 222.244999 101.962) (end 222.244999 99.067) (width 0.25) (layer F.Cu) (net 18))
(segment (start 222.244999 99.067) (end 221.84 98.662) (width 0.25) (layer F.Cu) (net 18))
(segment (start 216.245 101.962) (end 216.245 99.067) (width 0.25) (layer F.Cu) (net 18))
(segment (start 216.245 99.067) (end 215.84 98.662) (width 0.25) (layer F.Cu) (net 18))
(segment (start 210.245 101.962) (end 210.245 99.067) (width 0.25) (layer F.Cu) (net 18))
(segment (start 210.245 99.067) (end 209.84 98.662) (width 0.25) (layer F.Cu) (net 18))
(segment (start 204.245 101.962) (end 204.245 99.067) (width 0.25) (layer F.Cu) (net 18))
(segment (start 204.245 99.067) (end 203.84 98.662) (width 0.25) (layer F.Cu) (net 18))
(segment (start 198.245001 101.962) (end 198.245001 99.067) (width 0.25) (layer F.Cu) (net 18))
(segment (start 198.245001 99.067) (end 197.84 98.662) (width 0.25) (layer F.Cu) (net 18))
(segment (start 192.245 101.962) (end 192.245 99.067) (width 0.25) (layer F.Cu) (net 18))
(segment (start 192.245 99.067) (end 191.84 98.662) (width 0.25) (layer F.Cu) (net 18))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 210.235877 68.692513) (end 207.340877 68.692513) (width 0.25) (layer F.Cu) (net 18))
(segment (start 207.340877 68.692513) (end 206.935876 68.287513) (width 0.25) (layer F.Cu) (net 18))
(segment (start 210.235877 74.692513) (end 207.340877 74.692513) (width 0.25) (layer F.Cu) (net 18))
(segment (start 207.340877 74.692513) (end 206.935877 74.287513) (width 0.25) (layer F.Cu) (net 18))
(segment (start 210.235877 80.692513) (end 207.340876 80.692514) (width 0.25) (layer F.Cu) (net 18))
(segment (start 207.340876 80.692514) (end 206.935875 80.287512) (width 0.25) (layer F.Cu) (net 18))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(segment (start 174.945 79.998) (end 174.945 82.893) (width 0.25) (layer F.Cu) (net 18))
(segment (start 174.945 82.893) (end 174.54 83.298) (width 0.25) (layer F.Cu) (net 18))
(segment (start 168.945 79.998) (end 168.944999 82.893001) (width 0.25) (layer F.Cu) (net 18))
(segment (start 168.944999 82.893001) (end 168.54 83.298) (width 0.25) (layer F.Cu) (net 18))
(segment (start 162.945001 79.998) (end 162.945001 82.893) (width 0.25) (layer F.Cu) (net 18))
(segment (start 162.945001 82.893) (end 162.54 83.298001) (width 0.25) (layer F.Cu) (net 18))
(segment (start 156.945 79.998) (end 156.945 82.893) (width 0.25) (layer F.Cu) (net 18))
(segment (start 156.945 82.893) (end 156.54 83.298) (width 0.25) (layer F.Cu) (net 18))
(segment (start 150.945 79.998) (end 150.945 82.893) (width 0.25) (layer F.Cu) (net 18))
(segment (start 150.945 82.893) (end 150.54 83.298) (width 0.25) (layer F.Cu) (net 18))
(segment (start 147.049 117.139001) (end 147.049 108.757001) (width 0.25) (layer F.Cu) (net 18))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 160.782 100.457) (end 160.782 97.663) (width 0.25) (layer F.Cu) (net 19))
(segment (start 160.782 103.251) (end 160.782 100.457) (width 0.25) (layer F.Cu) (net 19))
(segment (start 160.782 106.045) (end 160.782 103.251) (width 0.25) (layer F.Cu) (net 19))
(segment (start 210.235879 64.882513) (end 210.235877 62.337513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 210.235877 62.337513) (end 210.285877 62.287513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 210.285877 62.287513) (end 210.885877 62.287513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 210.235879 64.882513) (end 207.340877 64.882513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 207.340877 64.882513) (end 206.935877 65.287513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 210.235877 70.882513) (end 207.340877 70.882513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 207.340877 70.882513) (end 206.935877 71.287512) (width 0.25) (layer F.Cu) (net 19))
(segment (start 210.235877 76.882513) (end 207.340877 76.882513) (width 0.25) (layer F.Cu) (net 19))
(segment (start 207.340877 76.882513) (end 206.935876 77.287513) (width 0.25) (layer F.Cu) (net 19))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(segment (start 171.135 79.998) (end 171.135 82.893) (width 0.25) (layer F.Cu) (net 19))
(segment (start 171.135 82.893) (end 171.539999 83.298001) (width 0.25) (layer F.Cu) (net 19))
(segment (start 165.134999 79.998) (end 165.135 82.892999) (width 0.25) (layer F.Cu) (net 19))
(segment (start 165.135 82.892999) (end 165.54 83.298) (width 0.25) (layer F.Cu) (net 19))
(segment (start 159.135 79.998) (end 159.135 82.893) (width 0.25) (layer F.Cu) (net 19))
(segment (start 153.135 79.998) (end 153.135 82.893) (width 0.25) (layer F.Cu) (net 19))
(segment (start 153.135 82.893) (end 153.54 83.298001) (width 0.25) (layer F.Cu) (net 19))
(segment (start 147.134999 79.998) (end 147.135 82.892999) (width 0.25) (layer F.Cu) (net 19))
(segment (start 147.135 82.892999) (end 147.54 83.298) (width 0.25) (layer F.Cu) (net 19))
(segment (start 147.049 106.089999) (end 147.049 97.707999) (width 0.25) (layer F.Cu) (net 19))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 230.4415 109.474) (end 228.6335 109.474) (width 0.5) (layer F.Cu) (net 20))
(segment (start 228.6335 109.474) (end 227.0125 107.853) (width 0.5) (layer F.Cu) (net 20))
(segment (start 221.869 88.2015) (end 221.869 84.2645) (width 0.5) (layer F.Cu) (net 20))
(segment (start 227.0125 107.853) (end 227.0125 93.345) (width 0.5) (layer F.Cu) (net 20))
(segment (start 227.0125 93.345) (end 221.869 88.2015) (width 0.5) (layer F.Cu) (net 20))
(segment (start 214.360877 77.167623) (end 214.645987 76.882513) (width 0.5) (layer F.Cu) (net 20))
(segment (start 221.869 84.2645) (end 220.4085 84.2645) (width 0.5) (layer F.Cu) (net 20))
(segment (start 220.4085 84.2645) (end 218.313 82.169) (width 0.5) (layer F.Cu) (net 20))
(segment (start 218.313 82.169) (end 214.8205 82.169) (width 0.5) (layer F.Cu) (net 20))
(segment (start 214.8205 82.169) (end 214.360877 81.709377) (width 0.5) (layer F.Cu) (net 20))
(segment (start 214.360877 81.709377) (end 214.360877 77.167623) (width 0.5) (layer F.Cu) (net 20))
(segment (start 214.645987 76.882513) (end 215.635877 76.882513) (width 0.5) (layer F.Cu) (net 20))
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(segment (start 187.96001 114.30001) (end 187.96 114.30001) (width 0.25) (layer B.Cu) (net 20))
(segment (start 187.96 114.3) (end 187.96 114.30001) (width 0.25) (layer F.Cu) (net 20))
(via (at 205.74 114.045999) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 20))
(segment (start 205.74 115.824) (end 205.74 114.045999) (width 0.25) (layer B.Cu) (net 20))
(segment (start 188.214 114.554) (end 187.96001 114.30001) (width 0.25) (layer B.Cu) (net 20))
(via (at 187.96 114.30001) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 20))
(segment (start 189.484 115.824) (end 188.214 114.554) (width 0.25) (layer B.Cu) (net 20))
(segment (start 189.357001 117.442) (end 189.357 115.951) (width 0.25) (layer F.Cu) (net 20))
(segment (start 189.357 115.951) (end 189.484 115.824) (width 0.25) (layer F.Cu) (net 20))
(via (at 189.484 115.824) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 20))
(segment (start 205.612999 117.442) (end 205.613 115.951) (width 0.25) (layer F.Cu) (net 20))
(segment (start 205.613 115.951) (end 205.74 115.824) (width 0.25) (layer F.Cu) (net 20))
(via (at 205.74 115.824) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 20))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 215.485877 62.287512) (end 215.485876 64.732513) (width 0.25) (layer F.Cu) (net 20))
(segment (start 215.485876 64.732513) (end 215.635875 64.882512) (width 0.25) (layer F.Cu) (net 20))
(segment (start 215.635877 76.882513) (end 218.530877 76.882513) (width 0.25) (layer F.Cu) (net 20))
(segment (start 218.530877 76.882513) (end 218.935877 77.287513) (width 0.25) (layer F.Cu) (net 20))
(segment (start 215.635877 70.882514) (end 218.530878 70.882513) (width 0.25) (layer F.Cu) (net 20))
(segment (start 218.530878 70.882513) (end 218.935877 71.287512) (width 0.25) (layer F.Cu) (net 20))
(segment (start 215.635875 64.882512) (end 218.530877 64.882512) (width 0.25) (layer F.Cu) (net 20))
(segment (start 218.530877 64.882512) (end 218.935877 65.287513) (width 0.25) (layer F.Cu) (net 20))
(segment (start 217.385877 62.287513) (end 219.386857 62.287512) (width 0.25) (layer F.Cu) (net 21))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 204.88402 63.119) (end 206.756 63.119) (width 0.25) (layer F.Cu) (net 22))
(segment (start 153.924 131.506) (end 153.924 133.31698) (width 0.25) (layer F.Cu) (net 23))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 215.635877 79.422513) (end 220.441879 79.422513) (width 0.25) (layer F.Cu) (net 24))
(segment (start 220.441879 79.422513) (end 222.504 81.484634) (width 0.25) (layer F.Cu) (net 24))
(segment (start 222.504 81.484634) (end 222.504 85.265636) (width 0.25) (layer F.Cu) (net 24))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 222.504 85.265636) (end 222.963364 85.725) (width 0.25) (layer F.Cu) (net 24))
(segment (start 227.822 86.344) (end 227.822 88.279) (width 0.25) (layer F.Cu) (net 24))
(segment (start 222.963364 85.725) (end 227.203 85.725) (width 0.25) (layer F.Cu) (net 24))
(segment (start 227.203 85.725) (end 227.822 86.344) (width 0.25) (layer F.Cu) (net 24))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 227.822 88.279) (end 227.822 89.154) (width 0.25) (layer F.Cu) (net 24))
(segment (start 231.648 89.154) (end 231.648 86.934) (width 0.25) (layer F.Cu) (net 24))
(segment (start 231.648 86.934) (end 231.582 86.868) (width 0.25) (layer F.Cu) (net 24))
(segment (start 227.822 89.154) (end 227.822 90.029) (width 0.25) (layer F.Cu) (net 24))
(segment (start 227.822 90.029) (end 228.725 90.932) (width 0.25) (layer F.Cu) (net 24))
(segment (start 228.725 90.932) (end 230.886 90.932) (width 0.25) (layer F.Cu) (net 24))
(segment (start 230.886 90.932) (end 231.648 90.17) (width 0.25) (layer F.Cu) (net 24))
(segment (start 231.648 90.17) (end 231.648 89.154) (width 0.25) (layer F.Cu) (net 24))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 224.536 80.518) (end 224.028 80.01) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.536 80.518) (end 224.5995 80.5815) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.5995 80.5815) (end 224.5995 82.312) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.5995 81.2165) (end 224.5995 82.312) (width 0.25) (layer F.Cu) (net 25))
(segment (start 227.076 83.291001) (end 224.828501 83.291001) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.828501 83.291001) (end 224.5995 83.062) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.5995 83.062) (end 224.5995 82.312) (width 0.25) (layer F.Cu) (net 25))
(segment (start 227.076 83.291001) (end 226.162001 83.291001) (width 0.25) (layer F.Cu) (net 25))
(segment (start 228.708001 83.291001) (end 227.076 83.291001) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.028 80.01) (end 224.028 73.66) (width 0.25) (layer F.Cu) (net 25))
(segment (start 224.028 73.66) (end 223.790513 73.422513) (width 0.25) (layer F.Cu) (net 25))
(segment (start 223.790513 73.422513) (end 215.635877 73.422513) (width 0.25) (layer F.Cu) (net 25))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 231.648 82.296) (end 231.648 80.01) (width 0.25) (layer F.Cu) (net 25))
(segment (start 228.708001 83.291001) (end 230.952999 83.291001) (width 0.25) (layer F.Cu) (net 25))
(segment (start 230.952999 83.291001) (end 231.648 82.596) (width 0.25) (layer F.Cu) (net 25))
(segment (start 231.648 82.596) (end 231.648 82.296) (width 0.25) (layer F.Cu) (net 25))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 231.648001 74.295) (end 231.648001 73.152001) (width 0.25) (layer F.Cu) (net 26))
(segment (start 231.521001 74.168) (end 228.092 74.168) (width 0.25) (layer F.Cu) (net 26))
(segment (start 231.648001 75.438) (end 231.648001 74.295) (width 0.25) (layer F.Cu) (net 26))
(segment (start 231.648001 74.295) (end 231.521001 74.168) (width 0.25) (layer F.Cu) (net 26))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 227.076 72.727736) (end 227.076 73.152) (width 0.25) (layer F.Cu) (net 26))
(segment (start 227.076 68.326) (end 227.076 72.727736) (width 0.25) (layer F.Cu) (net 26))
(segment (start 226.172513 67.422513) (end 227.076 68.326) (width 0.25) (layer F.Cu) (net 26))
(segment (start 223.321601 67.447001) (end 223.346089 67.422513) (width 0.25) (layer F.Cu) (net 26))
(segment (start 222.702399 67.447001) (end 223.321601 67.447001) (width 0.25) (layer F.Cu) (net 26))
(segment (start 223.346089 67.422513) (end 226.172513 67.422513) (width 0.25) (layer F.Cu) (net 26))
(segment (start 222.677911 67.422513) (end 222.702399 67.447001) (width 0.25) (layer F.Cu) (net 26))
(segment (start 215.635877 67.422513) (end 222.677911 67.422513) (width 0.25) (layer F.Cu) (net 26))
(segment (start 227.33 73.406) (end 227.076 73.152) (width 0.25) (layer B.Cu) (net 26))
(via (at 227.076 73.152) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 26))
(segment (start 228.092 74.168) (end 227.33 73.406) (width 0.25) (layer B.Cu) (net 26))
(segment (start 227.838 75.438) (end 227.838 74.422) (width 0.25) (layer F.Cu) (net 26))
(segment (start 227.838 74.422) (end 228.092 74.168) (width 0.25) (layer F.Cu) (net 26))
(via (at 228.092 74.168) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 26))
(segment (start 231.648001 73.152001) (end 231.648 73.152) (width 0.25) (layer F.Cu) (net 26))
(segment (start 227.838 75.438) (end 227.838 75.563) (width 0.25) (layer F.Cu) (net 26))
(segment (start 231.648001 75.738) (end 231.648001 75.438) (width 0.25) (layer F.Cu) (net 26))
(segment (start 172.405001 68.824) (end 172.405 73.573) (width 0.25) (layer F.Cu) (net 27))
(segment (start 172.405 73.573) (end 172.405 74.598) (width 0.25) (layer F.Cu) (net 27))
(segment (start 173.675001 68.824) (end 173.675 73.573) (width 0.25) (layer F.Cu) (net 28))
(segment (start 173.675 73.573) (end 173.675 74.598) (width 0.25) (layer F.Cu) (net 28))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 171.539254 62.662) (end 172.440155 61.761099) (width 0.25) (layer F.Cu) (net 29))
(segment (start 172.948156 61.761099) (end 173.495255 61.214) (width 0.25) (layer F.Cu) (net 29))
(segment (start 171.135001 62.662) (end 171.539254 62.662) (width 0.25) (layer F.Cu) (net 29))
(segment (start 193.802 58.42) (end 216.821142 58.42) (width 0.25) (layer F.Cu) (net 29))
(segment (start 173.495255 61.214) (end 191.008 61.214) (width 0.25) (layer F.Cu) (net 29))
(segment (start 218.409519 53.639466) (end 218.409519 52.578) (width 0.25) (layer F.Cu) (net 29))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 191.008 61.214) (end 193.802 58.42) (width 0.25) (layer F.Cu) (net 29))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 218.409519 56.831623) (end 218.409519 53.639466) (width 0.25) (layer F.Cu) (net 29))
(segment (start 216.821142 58.42) (end 218.409519 56.831623) (width 0.25) (layer F.Cu) (net 29))
(segment (start 172.440155 61.761099) (end 172.948156 61.761099) (width 0.25) (layer F.Cu) (net 29))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 191.553989 61.684011) (end 194.31 58.928) (width 0.25) (layer F.Cu) (net 30))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 218.567 58.928) (end 219.679519 57.815481) (width 0.25) (layer F.Cu) (net 30))
(segment (start 172.71195 62.662) (end 173.689939 61.684011) (width 0.25) (layer F.Cu) (net 30))
(segment (start 219.679519 56.179466) (end 219.679519 55.118) (width 0.25) (layer F.Cu) (net 30))
(segment (start 172.405001 62.662) (end 172.71195 62.662) (width 0.25) (layer F.Cu) (net 30))
(segment (start 173.689939 61.684011) (end 191.553989 61.684011) (width 0.25) (layer F.Cu) (net 30))
(segment (start 194.31 58.928) (end 218.567 58.928) (width 0.25) (layer F.Cu) (net 30))
(segment (start 219.679519 57.815481) (end 219.679519 56.179466) (width 0.25) (layer F.Cu) (net 30))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 166.405 68.824) (end 166.405 69.849) (width 0.25) (layer F.Cu) (net 31))
(segment (start 166.405 69.849) (end 166.405 74.597999) (width 0.25) (layer F.Cu) (net 31))
(segment (start 167.675 74.597999) (end 167.675 68.824) (width 0.25) (layer F.Cu) (net 32))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 171.66142 59.881055) (end 172.16942 59.881055) (width 0.25) (layer F.Cu) (net 33))
(segment (start 167.369956 60.427044) (end 171.115431 60.427044) (width 0.25) (layer F.Cu) (net 33))
(segment (start 201.7141 55.7149) (end 201.7141 53.639466) (width 0.25) (layer F.Cu) (net 33))
(segment (start 172.16942 59.881055) (end 172.868474 59.182) (width 0.25) (layer F.Cu) (net 33))
(segment (start 201.041 56.388) (end 201.7141 55.7149) (width 0.25) (layer F.Cu) (net 33))
(segment (start 192.024 56.388) (end 201.041 56.388) (width 0.25) (layer F.Cu) (net 33))
(segment (start 172.868474 59.182) (end 189.23 59.182) (width 0.25) (layer F.Cu) (net 33))
(segment (start 165.135 62.662) (end 167.369956 60.427044) (width 0.25) (layer F.Cu) (net 33))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 189.23 59.182) (end 192.024 56.388) (width 0.25) (layer F.Cu) (net 33))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 201.7141 53.639466) (end 201.7141 52.578) (width 0.25) (layer F.Cu) (net 33))
(segment (start 171.115431 60.427044) (end 171.66142 59.881055) (width 0.25) (layer F.Cu) (net 33))
(segment (start 201.2061 56.896) (end 192.532 56.896) (width 0.25) (layer F.Cu) (net 34))
(segment (start 202.9841 55.118) (end 201.2061 56.896) (width 0.25) (layer F.Cu) (net 34))
(segment (start 166.405 62.187) (end 166.405 63.137) (width 0.25) (layer F.Cu) (net 34))
(segment (start 172.364104 60.351066) (end 171.856104 60.351066) (width 0.25) (layer F.Cu) (net 34))
(segment (start 189.738 59.69) (end 173.02517 59.69) (width 0.25) (layer F.Cu) (net 34))
(segment (start 171.310115 60.897055) (end 167.694945 60.897055) (width 0.25) (layer F.Cu) (net 34))
(segment (start 192.532 56.896) (end 189.738 59.69) (width 0.25) (layer F.Cu) (net 34))
(segment (start 173.02517 59.69) (end 172.364104 60.351066) (width 0.25) (layer F.Cu) (net 34))
(segment (start 171.856104 60.351066) (end 171.310115 60.897055) (width 0.25) (layer F.Cu) (net 34))
(segment (start 167.694945 60.897055) (end 166.405 62.187) (width 0.25) (layer F.Cu) (net 34))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 226.17176 80.56861) (end 226.17176 79.94396) (width 0.25) (layer F.Cu) (net 35))
(segment (start 226.550499 81.579999) (end 226.17176 81.20126) (width 0.25) (layer F.Cu) (net 35))
(segment (start 228.173001 81.579999) (end 226.550499 81.579999) (width 0.25) (layer F.Cu) (net 35))
(segment (start 228.473 81.28) (end 228.173001 81.579999) (width 0.25) (layer F.Cu) (net 35))
(segment (start 226.17176 81.20126) (end 226.17176 80.56861) (width 0.25) (layer F.Cu) (net 35))
(segment (start 228.727 84.582) (end 228.727 81.534) (width 0.25) (layer B.Cu) (net 35))
(segment (start 228.727 81.534) (end 228.473 81.28) (width 0.25) (layer B.Cu) (net 35))
(via (at 228.473 81.28) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 35))
(segment (start 229.682 84.582) (end 228.727 84.582) (width 0.25) (layer F.Cu) (net 35))
(via (at 228.727 84.582) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 35))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 229.682 86.868) (end 229.682 84.582) (width 0.25) (layer F.Cu) (net 35))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 229.68196 79.94396) (end 229.748 80.01) (width 0.25) (layer F.Cu) (net 36))
(segment (start 227.47224 79.94396) (end 229.68196 79.94396) (width 0.25) (layer F.Cu) (net 36))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 229.748 77.724) (end 229.748 80.01) (width 0.25) (layer F.Cu) (net 36))
(segment (start 227.47224 77.41939) (end 227.47224 78.04404) (width 0.25) (layer F.Cu) (net 37))
(segment (start 226.992999 76.940149) (end 227.47224 77.41939) (width 0.25) (layer F.Cu) (net 37))
(segment (start 228.153396 73.152) (end 226.992999 74.312397) (width 0.25) (layer F.Cu) (net 37))
(segment (start 229.748 73.152) (end 228.153396 73.152) (width 0.25) (layer F.Cu) (net 37))
(segment (start 226.992999 74.312397) (end 226.992999 76.940149) (width 0.25) (layer F.Cu) (net 37))
(segment (start 229.748 73.152) (end 229.748 70.932) (width 0.25) (layer F.Cu) (net 37))
(segment (start 229.748 70.932) (end 229.682 70.866) (width 0.25) (layer F.Cu) (net 37))
(segment (start 160.405 74.598) (end 160.405 68.824) (width 0.25) (layer F.Cu) (net 39))
(segment (start 161.675 68.824) (end 161.675 69.849) (width 0.25) (layer F.Cu) (net 40))
(segment (start 161.675 69.849) (end 161.675 74.598) (width 0.25) (layer F.Cu) (net 40))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 159.135 62.187) (end 162.775 58.547) (width 0.25) (layer F.Cu) (net 41))
(segment (start 170.336695 58.547) (end 171.263684 57.620011) (width 0.25) (layer F.Cu) (net 41))
(segment (start 162.775 58.547) (end 170.336695 58.547) (width 0.25) (layer F.Cu) (net 41))
(segment (start 171.263684 57.620011) (end 171.771684 57.620011) (width 0.25) (layer F.Cu) (net 41))
(segment (start 171.771684 57.620011) (end 172.241695 57.15) (width 0.25) (layer F.Cu) (net 41))
(segment (start 172.241695 57.15) (end 184.15 57.15) (width 0.25) (layer F.Cu) (net 41))
(segment (start 184.15 57.15) (end 185.039 56.261) (width 0.25) (layer F.Cu) (net 41))
(segment (start 185.039 56.261) (end 185.039 53.639466) (width 0.25) (layer F.Cu) (net 41))
(segment (start 185.039 53.639466) (end 185.039 52.578) (width 0.25) (layer F.Cu) (net 41))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 159.135 63.424) (end 159.135 62.187) (width 0.25) (layer F.Cu) (net 41))
(segment (start 159.135 62.662) (end 159.135 62.187) (width 0.25) (layer F.Cu) (net 41))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 172.39839 57.658) (end 171.585368 58.471022) (width 0.25) (layer F.Cu) (net 42))
(segment (start 184.830466 57.658) (end 172.39839 57.658) (width 0.25) (layer F.Cu) (net 42))
(segment (start 163.574989 59.017011) (end 160.405 62.187) (width 0.25) (layer F.Cu) (net 42))
(segment (start 170.531379 59.017011) (end 163.574989 59.017011) (width 0.25) (layer F.Cu) (net 42))
(segment (start 171.077368 58.471022) (end 170.531379 59.017011) (width 0.25) (layer F.Cu) (net 42))
(segment (start 171.585368 58.471022) (end 171.077368 58.471022) (width 0.25) (layer F.Cu) (net 42))
(segment (start 186.309 56.179466) (end 184.830466 57.658) (width 0.25) (layer F.Cu) (net 42))
(segment (start 186.309 55.118) (end 186.309 56.179466) (width 0.25) (layer F.Cu) (net 42))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 160.405 63.424) (end 160.405 62.187) (width 0.25) (layer F.Cu) (net 42))
(segment (start 160.405 62.662) (end 160.405 62.187) (width 0.25) (layer F.Cu) (net 42))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 186.309 55.118) (end 186.182 55.118) (width 0.25) (layer F.Cu) (net 42))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 154.405 74.598) (end 154.405001 73.572999) (width 0.25) (layer F.Cu) (net 43))
(segment (start 154.405001 73.572999) (end 154.405001 68.824) (width 0.25) (layer F.Cu) (net 43))
(segment (start 155.675001 68.824) (end 155.675 73.573) (width 0.25) (layer F.Cu) (net 44))
(segment (start 155.675 73.573) (end 155.675 74.598) (width 0.25) (layer F.Cu) (net 44))
(segment (start 153.135001 62.662) (end 153.135001 62.187) (width 0.25) (layer F.Cu) (net 45))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 153.135001 62.187) (end 155.772034 59.549967) (width 0.25) (layer F.Cu) (net 45))
(segment (start 155.772034 59.549967) (end 157.799949 59.549967) (width 0.25) (layer F.Cu) (net 45))
(segment (start 157.799949 59.549967) (end 160.834916 56.515) (width 0.25) (layer F.Cu) (net 45))
(segment (start 168.529 55.469446) (end 168.529 53.639466) (width 0.25) (layer F.Cu) (net 45))
(segment (start 160.834916 56.515) (end 167.483446 56.515) (width 0.25) (layer F.Cu) (net 45))
(segment (start 167.483446 56.515) (end 168.529 55.469446) (width 0.25) (layer F.Cu) (net 45))
(segment (start 168.529 53.639466) (end 168.529 52.578) (width 0.25) (layer F.Cu) (net 45))
(segment (start 169.799 55.118) (end 167.894 57.023) (width 0.25) (layer F.Cu) (net 46))
(segment (start 167.894 57.023) (end 160.991611 57.023) (width 0.25) (layer F.Cu) (net 46))
(segment (start 160.991611 57.023) (end 157.994633 60.019978) (width 0.25) (layer F.Cu) (net 46))
(segment (start 156.022023 60.019978) (end 154.405001 61.637) (width 0.25) (layer F.Cu) (net 46))
(segment (start 154.405001 61.637) (end 154.405001 62.662) (width 0.25) (layer F.Cu) (net 46))
(segment (start 157.994633 60.019978) (end 156.022023 60.019978) (width 0.25) (layer F.Cu) (net 46))
(segment (start 169.799 55.118) (end 169.545141 55.118) (width 0.25) (layer F.Cu) (net 46))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 148.404999 74.598001) (end 148.405 73.573) (width 0.25) (layer F.Cu) (net 47))
(segment (start 148.405 73.573) (end 148.405 68.824) (width 0.25) (layer F.Cu) (net 47))
(segment (start 149.675 68.824) (end 149.674999 73.573001) (width 0.25) (layer F.Cu) (net 48))
(segment (start 149.674999 73.573001) (end 149.674999 74.598001) (width 0.25) (layer F.Cu) (net 48))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 147.135 63.424) (end 147.135 61.145) (width 0.25) (layer F.Cu) (net 49))
(segment (start 147.135 61.145) (end 152.019 56.261) (width 0.25) (layer F.Cu) (net 49))
(segment (start 152.019 56.261) (end 152.019 53.639466) (width 0.25) (layer F.Cu) (net 49))
(segment (start 152.019 53.639466) (end 152.019 52.578) (width 0.25) (layer F.Cu) (net 49))
(segment (start 148.405 63.424) (end 148.405 61.849) (width 0.25) (layer F.Cu) (net 50))
(segment (start 153.289 56.515) (end 148.405 61.399) (width 0.25) (layer F.Cu) (net 50))
(segment (start 148.405 61.399) (end 148.405 61.849) (width 0.25) (layer F.Cu) (net 50))
(segment (start 153.289 55.118) (end 153.289 56.515) (width 0.25) (layer F.Cu) (net 50))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 231.582 84.582) (end 234.29976 84.582) (width 0.25) (layer F.Cu) (net 51))
(segment (start 234.29976 84.582) (end 234.98194 85.26418) (width 0.25) (layer F.Cu) (net 51))
(segment (start 234.98194 85.26418) (end 234.98194 86.01475) (width 0.25) (layer F.Cu) (net 51))
(segment (start 234.98194 86.01475) (end 236.23143 87.26424) (width 0.25) (layer F.Cu) (net 51))
(segment (start 236.23143 87.26424) (end 236.982 87.26424) (width 0.25) (layer F.Cu) (net 51))
(segment (start 236.982 80.264) (end 233.888 80.264) (width 0.25) (layer F.Cu) (net 52))
(segment (start 233.888 80.264) (end 231.648 78.024) (width 0.25) (layer F.Cu) (net 52))
(segment (start 231.648 78.024) (end 231.648 77.724) (width 0.25) (layer F.Cu) (net 52))
(segment (start 231.582 70.866) (end 234.58424 70.866) (width 0.25) (layer F.Cu) (net 53))
(segment (start 234.58424 70.866) (end 234.98194 71.2637) (width 0.25) (layer F.Cu) (net 53))
(segment (start 234.98194 71.2637) (end 234.98194 72.01427) (width 0.25) (layer F.Cu) (net 53))
(segment (start 234.98194 72.01427) (end 236.23143 73.26376) (width 0.25) (layer F.Cu) (net 53))
(segment (start 236.23143 73.26376) (end 236.982 73.26376) (width 0.25) (layer F.Cu) (net 53))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 228.270022 63.550578) (end 229.489 62.3316) (width 0.25) (layer F.Cu) (net 54))
(segment (start 228.270022 66.242978) (end 228.270022 63.550578) (width 0.25) (layer F.Cu) (net 54))
(segment (start 223.012 66.802) (end 227.711 66.802) (width 0.25) (layer F.Cu) (net 54))
(segment (start 229.489 62.3316) (end 229.616 62.3316) (width 0.25) (layer F.Cu) (net 54))
(segment (start 227.711 66.802) (end 228.270022 66.242978) (width 0.25) (layer F.Cu) (net 54))
(segment (start 223.012 69.258264) (end 223.012 68.834) (width 0.25) (layer F.Cu) (net 54))
(segment (start 223.012 71.755) (end 223.012 69.258264) (width 0.25) (layer F.Cu) (net 54))
(segment (start 222.25 72.517) (end 223.012 71.755) (width 0.25) (layer F.Cu) (net 54))
(segment (start 223.012 68.58) (end 223.012 68.834) (width 0.25) (layer B.Cu) (net 54))
(via (at 223.012 68.834) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 54))
(segment (start 223.012 66.802) (end 223.012 68.58) (width 0.25) (layer B.Cu) (net 54))
(via (at 222.25 72.517) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 54))
(segment (start 222.25 75.184) (end 222.25 72.517) (width 0.25) (layer B.Cu) (net 54))
routed some more.
2015-11-17 16:48:00 +00:00
(via (at 223.012 66.802) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 54))
(via (at 222.25 75.184) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 54))
(segment (start 221.313487 78.152513) (end 222.25 77.216) (width 0.25) (layer F.Cu) (net 54))
(segment (start 222.25 77.216) (end 222.25 75.184) (width 0.25) (layer F.Cu) (net 54))
(segment (start 215.635877 78.152513) (end 221.313487 78.152513) (width 0.25) (layer F.Cu) (net 54))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 221.996 65.786) (end 227.203 65.786) (width 0.25) (layer F.Cu) (net 55))
(segment (start 227.203 65.786) (end 227.800011 65.188989) (width 0.25) (layer F.Cu) (net 55))
(segment (start 229.489 55.2196) (end 229.616 55.2196) (width 0.25) (layer F.Cu) (net 55))
(segment (start 227.800011 65.188989) (end 227.800011 56.908589) (width 0.25) (layer F.Cu) (net 55))
(segment (start 227.800011 56.908589) (end 229.489 55.2196) (width 0.25) (layer F.Cu) (net 55))
(segment (start 221.996 68.833996) (end 221.996004 68.834) (width 0.25) (layer B.Cu) (net 55))
(segment (start 221.996 65.786) (end 221.996 68.833996) (width 0.25) (layer B.Cu) (net 55))
(segment (start 221.996004 71.816394) (end 221.996004 69.258264) (width 0.25) (layer F.Cu) (net 55))
(segment (start 221.659885 72.152513) (end 221.996004 71.816394) (width 0.25) (layer F.Cu) (net 55))
(segment (start 221.996004 69.258264) (end 221.996004 68.834) (width 0.25) (layer F.Cu) (net 55))
(segment (start 215.635877 72.152513) (end 221.659885 72.152513) (width 0.25) (layer F.Cu) (net 55))
(via (at 221.996004 68.834) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 55))
routed some more.
2015-11-17 16:48:00 +00:00
(via (at 221.996 65.786) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 55))
(segment (start 215.635877 66.152513) (end 220.613487 66.152513) (width 0.25) (layer F.Cu) (net 56))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 226.695 64.897) (end 227.33 64.262) (width 0.25) (layer F.Cu) (net 56))
(segment (start 221.869 64.897) (end 226.695 64.897) (width 0.25) (layer F.Cu) (net 56))
(segment (start 227.33 64.262) (end 227.33 48.768) (width 0.25) (layer F.Cu) (net 56))
(segment (start 220.613487 66.152513) (end 221.869 64.897) (width 0.25) (layer F.Cu) (net 56))
(segment (start 227.33 48.768) (end 227.7364 48.3616) (width 0.25) (layer F.Cu) (net 56))
(segment (start 227.7364 48.3616) (end 229.616 48.3616) (width 0.25) (layer F.Cu) (net 56))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 216.660877 66.152514) (end 215.635876 66.152513) (width 0.25) (layer F.Cu) (net 56))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 218.985989 95.795989) (end 210.976769 95.795989) (width 0.25) (layer F.Cu) (net 57))
(segment (start 170.239538 91.364022) (end 163.576 98.02756) (width 0.25) (layer F.Cu) (net 57))
(segment (start 208.042736 92.861956) (end 202.86543 92.861956) (width 0.25) (layer F.Cu) (net 57))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 219.705 96.515) (end 218.985989 95.795989) (width 0.25) (layer F.Cu) (net 57))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 202.86543 92.861956) (end 201.367496 91.364022) (width 0.25) (layer F.Cu) (net 57))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 210.976769 95.795989) (end 208.042736 92.861956) (width 0.25) (layer F.Cu) (net 57))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 163.576 98.02756) (end 163.576 99.06) (width 0.25) (layer F.Cu) (net 57))
(segment (start 201.367496 91.364022) (end 170.239538 91.364022) (width 0.25) (layer F.Cu) (net 57))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 219.705 101.962) (end 219.705 96.515) (width 0.25) (layer F.Cu) (net 57))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 202.670746 93.331967) (end 201.172812 91.834033) (width 0.25) (layer F.Cu) (net 58))
(segment (start 214.975 101.962) (end 214.975 97.119) (width 0.25) (layer F.Cu) (net 58))
(segment (start 164.337999 101.092001) (end 163.576 101.854) (width 0.25) (layer F.Cu) (net 58))
(segment (start 164.683001 97.585253) (end 164.683001 100.746999) (width 0.25) (layer F.Cu) (net 58))
(segment (start 170.434221 91.834033) (end 164.683001 97.585253) (width 0.25) (layer F.Cu) (net 58))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 214.122 96.266) (end 210.782085 96.266) (width 0.25) (layer F.Cu) (net 58))
(segment (start 214.975 97.119) (end 214.122 96.266) (width 0.25) (layer F.Cu) (net 58))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 201.172812 91.834033) (end 170.434221 91.834033) (width 0.25) (layer F.Cu) (net 58))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 207.848052 93.331967) (end 202.670746 93.331967) (width 0.25) (layer F.Cu) (net 58))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 210.782085 96.266) (end 207.848052 93.331967) (width 0.25) (layer F.Cu) (net 58))
(segment (start 164.683001 100.746999) (end 164.337999 101.092001) (width 0.25) (layer F.Cu) (net 58))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 207.705 100.937) (end 207.705 101.962) (width 0.25) (layer F.Cu) (net 59))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 200.600684 93.255989) (end 202.340694 94.996) (width 0.25) (layer F.Cu) (net 59))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 207.264 94.996) (end 207.705 95.437) (width 0.25) (layer F.Cu) (net 59))
(segment (start 202.340694 94.996) (end 207.264 94.996) (width 0.25) (layer F.Cu) (net 59))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 171.006351 93.255989) (end 200.600684 93.255989) (width 0.25) (layer F.Cu) (net 59))
(segment (start 166.093034 107.591966) (end 166.093034 98.169306) (width 0.25) (layer F.Cu) (net 59))
(segment (start 163.576 110.109) (end 166.093034 107.591966) (width 0.25) (layer F.Cu) (net 59))
(segment (start 166.093034 98.169306) (end 171.006351 93.255989) (width 0.25) (layer F.Cu) (net 59))
(segment (start 207.705 95.437) (end 207.705 100.937) (width 0.25) (layer F.Cu) (net 59))
(segment (start 163.576 118.364) (end 167.503067 114.436933) (width 0.25) (layer F.Cu) (net 60))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 196.975 100.937) (end 196.975 101.962) (width 0.25) (layer F.Cu) (net 60))
(segment (start 195.834 94.742) (end 196.975 95.883) (width 0.25) (layer F.Cu) (net 60))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 171.514424 94.742) (end 195.834 94.742) (width 0.25) (layer F.Cu) (net 60))
(segment (start 167.503067 114.436933) (end 167.503067 98.753357) (width 0.25) (layer F.Cu) (net 60))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 196.975 95.883) (end 196.975 100.937) (width 0.25) (layer F.Cu) (net 60))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 167.503067 98.753357) (end 171.514424 94.742) (width 0.25) (layer F.Cu) (net 60))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 199.644 94.234) (end 201.705 96.295) (width 0.25) (layer F.Cu) (net 61))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 167.033056 98.558674) (end 171.35773 94.234) (width 0.25) (layer F.Cu) (net 61))
(segment (start 171.35773 94.234) (end 199.644 94.234) (width 0.25) (layer F.Cu) (net 61))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 201.705 100.937) (end 201.705 101.962) (width 0.25) (layer F.Cu) (net 61))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 163.576 115.697) (end 167.033056 112.239944) (width 0.25) (layer F.Cu) (net 61))
(segment (start 167.033056 112.239944) (end 167.033056 98.558674) (width 0.25) (layer F.Cu) (net 61))
(segment (start 201.705 96.295) (end 201.705 100.937) (width 0.25) (layer F.Cu) (net 61))
(segment (start 165.623013 120.634987) (end 168.9131 117.3449) (width 0.25) (layer F.Cu) (net 62))
(segment (start 160.782 122.555) (end 163.817362 122.555) (width 0.25) (layer F.Cu) (net 62))
(segment (start 168.9131 117.3449) (end 168.9131 99.337406) (width 0.25) (layer F.Cu) (net 62))
(segment (start 163.817362 122.555) (end 165.623013 120.749349) (width 0.25) (layer F.Cu) (net 62))
(segment (start 171.984506 96.266) (end 188.815002 96.266) (width 0.25) (layer F.Cu) (net 62))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 189.705 97.155998) (end 189.705 100.937) (width 0.25) (layer F.Cu) (net 62))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 168.9131 99.337406) (end 171.984506 96.266) (width 0.25) (layer F.Cu) (net 62))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 189.705 100.937) (end 189.705 101.962) (width 0.25) (layer F.Cu) (net 62))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 188.815002 96.266) (end 189.705 97.155998) (width 0.25) (layer F.Cu) (net 62))
(segment (start 165.623013 120.749349) (end 165.623013 120.634987) (width 0.25) (layer F.Cu) (net 62))
(segment (start 171.671118 95.25) (end 193.799002 95.25) (width 0.25) (layer F.Cu) (net 63))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 195.705 97.155998) (end 195.705 100.937) (width 0.25) (layer F.Cu) (net 63))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 167.973078 115.605284) (end 167.973078 98.94804) (width 0.25) (layer F.Cu) (net 63))
(segment (start 160.782 119.888) (end 163.690362 119.888) (width 0.25) (layer F.Cu) (net 63))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 195.705 100.937) (end 195.705 101.962) (width 0.25) (layer F.Cu) (net 63))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 167.973078 98.94804) (end 171.671118 95.25) (width 0.25) (layer F.Cu) (net 63))
(segment (start 193.799002 95.25) (end 195.705 97.155998) (width 0.25) (layer F.Cu) (net 63))
(segment (start 163.690362 119.888) (end 167.973078 115.605284) (width 0.25) (layer F.Cu) (net 63))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 189.640695 95.758) (end 190.975 97.092305) (width 0.25) (layer F.Cu) (net 64))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 163.576 121.158) (end 168.443089 116.290911) (width 0.25) (layer F.Cu) (net 64))
(segment (start 171.827812 95.758) (end 189.640695 95.758) (width 0.25) (layer F.Cu) (net 64))
(segment (start 168.443089 116.290911) (end 168.443089 99.142723) (width 0.25) (layer F.Cu) (net 64))
(segment (start 190.975 97.092305) (end 190.975 100.937) (width 0.25) (layer F.Cu) (net 64))
(segment (start 168.443089 99.142723) (end 171.827812 95.758) (width 0.25) (layer F.Cu) (net 64))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 190.975 100.937) (end 190.975 101.962) (width 0.25) (layer F.Cu) (net 64))
(segment (start 203.060114 92.391945) (end 201.56218 90.894011) (width 0.25) (layer F.Cu) (net 65))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 219.964 95.25) (end 211.095475 95.25) (width 0.25) (layer F.Cu) (net 65))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 208.23742 92.391945) (end 203.060114 92.391945) (width 0.25) (layer F.Cu) (net 65))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 164.65363 96.266) (end 163.576 96.266) (width 0.25) (layer F.Cu) (net 65))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 220.975 101.962) (end 220.975 96.261) (width 0.25) (layer F.Cu) (net 65))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 164.672864 96.266) (end 164.65363 96.266) (width 0.25) (layer F.Cu) (net 65))
(segment (start 201.56218 90.894011) (end 170.044853 90.894011) (width 0.25) (layer F.Cu) (net 65))
(segment (start 211.095475 95.25) (end 208.23742 92.391945) (width 0.25) (layer F.Cu) (net 65))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 220.975 96.261) (end 219.964 95.25) (width 0.25) (layer F.Cu) (net 65))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 170.044853 90.894011) (end 164.672864 96.266) (width 0.25) (layer F.Cu) (net 65))
(segment (start 165.623023 97.974621) (end 170.811666 92.785978) (width 0.25) (layer F.Cu) (net 66))
(segment (start 170.811666 92.785978) (end 200.795369 92.785979) (width 0.25) (layer F.Cu) (net 66))
(segment (start 165.623023 105.267977) (end 165.623023 97.974621) (width 0.25) (layer F.Cu) (net 66))
(segment (start 208.975 100.937) (end 208.975 101.962) (width 0.25) (layer F.Cu) (net 66))
(segment (start 207.458684 94.271989) (end 208.975 95.788305) (width 0.25) (layer F.Cu) (net 66))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 202.281378 94.271989) (end 207.458684 94.271989) (width 0.25) (layer F.Cu) (net 66))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 163.576 107.315) (end 165.623023 105.267977) (width 0.25) (layer F.Cu) (net 66))
(segment (start 200.795369 92.785979) (end 202.281378 94.271989) (width 0.25) (layer F.Cu) (net 66))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 208.975 95.788305) (end 208.975 100.937) (width 0.25) (layer F.Cu) (net 66))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 207.653368 93.801978) (end 202.476062 93.801978) (width 0.25) (layer F.Cu) (net 67))
(segment (start 200.978128 92.304044) (end 170.628906 92.304044) (width 0.25) (layer F.Cu) (net 67))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 213.705 97.155998) (end 213.323002 96.774) (width 0.25) (layer F.Cu) (net 67))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 213.705 101.962) (end 213.705 97.155998) (width 0.25) (layer F.Cu) (net 67))
(segment (start 165.153012 102.943988) (end 164.337999 103.759001) (width 0.25) (layer F.Cu) (net 67))
(segment (start 170.628906 92.304044) (end 165.153012 97.779938) (width 0.25) (layer F.Cu) (net 67))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 213.323002 96.774) (end 210.62539 96.774) (width 0.25) (layer F.Cu) (net 67))
(segment (start 210.62539 96.774) (end 207.653368 93.801978) (width 0.25) (layer F.Cu) (net 67))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 164.337999 103.759001) (end 163.576 104.521) (width 0.25) (layer F.Cu) (net 67))
(segment (start 165.153012 97.779938) (end 165.153012 102.943988) (width 0.25) (layer F.Cu) (net 67))
(segment (start 202.476062 93.801978) (end 200.978128 92.304044) (width 0.25) (layer F.Cu) (net 67))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 200.406 93.726) (end 202.975 96.295) (width 0.25) (layer F.Cu) (net 68))
(segment (start 202.975 96.295) (end 202.975 100.937) (width 0.25) (layer F.Cu) (net 68))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 166.563045 98.363989) (end 171.201034 93.726) (width 0.25) (layer F.Cu) (net 68))
(segment (start 171.201034 93.726) (end 200.406 93.726) (width 0.25) (layer F.Cu) (net 68))
(segment (start 166.563045 109.915955) (end 166.563045 98.363989) (width 0.25) (layer F.Cu) (net 68))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 202.975 100.937) (end 202.975 101.962) (width 0.25) (layer F.Cu) (net 68))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 163.576 112.903) (end 166.563045 109.915955) (width 0.25) (layer F.Cu) (net 68))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 223.88557 125.33357) (end 224.917 126.365) (width 0.25) (layer F.Cu) (net 69))
(segment (start 224.917 126.365) (end 224.917 129.794) (width 0.25) (layer F.Cu) (net 69))
(segment (start 218.313 124.19057) (end 219.456 125.33357) (width 0.25) (layer F.Cu) (net 69))
(segment (start 219.456 125.33357) (end 223.88557 125.33357) (width 0.25) (layer F.Cu) (net 69))
(segment (start 218.313 122.588) (end 218.313 124.19057) (width 0.25) (layer F.Cu) (net 69))
(segment (start 218.313 122.588) (end 218.313 123.038) (width 0.25) (layer F.Cu) (net 69))
(segment (start 217.042999 122.588) (end 217.042999 123.824999) (width 0.25) (layer F.Cu) (net 70))
(segment (start 217.042999 123.824999) (end 219.202 125.984) (width 0.25) (layer F.Cu) (net 70))
(segment (start 222.504 125.984) (end 223.338858 126.818858) (width 0.25) (layer F.Cu) (net 70))
(segment (start 225.806 131.572) (end 226.187 131.191) (width 0.25) (layer F.Cu) (net 70))
(segment (start 219.202 125.984) (end 222.504 125.984) (width 0.25) (layer F.Cu) (net 70))
(segment (start 223.338858 126.818858) (end 223.338858 131.136858) (width 0.25) (layer F.Cu) (net 70))
(segment (start 223.338858 131.136858) (end 223.774 131.572) (width 0.25) (layer F.Cu) (net 70))
(segment (start 223.774 131.572) (end 225.806 131.572) (width 0.25) (layer F.Cu) (net 70))
(segment (start 226.187 131.191) (end 226.187 127.254) (width 0.25) (layer F.Cu) (net 70))
(segment (start 223.392999 122.588) (end 223.393 124.079) (width 0.25) (layer F.Cu) (net 71))
(segment (start 223.393 124.079) (end 224.536 125.222) (width 0.25) (layer F.Cu) (net 71))
(segment (start 224.536 125.222) (end 227.076 125.222) (width 0.25) (layer F.Cu) (net 71))
(segment (start 227.456999 125.603) (end 227.457 128.732534) (width 0.25) (layer F.Cu) (net 71))
(segment (start 227.076 125.222) (end 227.456999 125.603) (width 0.25) (layer F.Cu) (net 71))
(segment (start 227.457 128.732534) (end 227.457 129.794) (width 0.25) (layer F.Cu) (net 71))
(segment (start 223.392999 122.588) (end 223.393 123.038001) (width 0.25) (layer F.Cu) (net 71))
(segment (start 228.727 127.254) (end 226.176999 124.703999) (width 0.25) (layer B.Cu) (net 72))
(segment (start 226.176999 117.71776) (end 226.516691 117.378068) (width 0.25) (layer B.Cu) (net 72))
(segment (start 226.176999 124.703999) (end 226.176999 117.71776) (width 0.25) (layer B.Cu) (net 72))
(segment (start 226.516691 117.378068) (end 226.81669 117.078068) (width 0.25) (layer B.Cu) (net 72))
(segment (start 226.706758 117.188) (end 226.81669 117.078068) (width 0.25) (layer F.Cu) (net 72))
(segment (start 225.933 117.188) (end 226.706758 117.188) (width 0.25) (layer F.Cu) (net 72))
(via (at 226.81669 117.078068) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 72))
(segment (start 226.822 118.11) (end 226.822001 123.571) (width 0.25) (layer B.Cu) (net 73))
(segment (start 226.822001 123.571) (end 229.997001 126.746) (width 0.25) (layer B.Cu) (net 73))
(segment (start 229.997001 126.746) (end 229.997 129.794) (width 0.25) (layer B.Cu) (net 73))
(segment (start 225.435021 118.410021) (end 226.521979 118.410021) (width 0.25) (layer F.Cu) (net 73))
(segment (start 224.663 117.187999) (end 224.663001 117.638) (width 0.25) (layer F.Cu) (net 73))
(segment (start 226.522001 118.409999) (end 226.822 118.11) (width 0.25) (layer F.Cu) (net 73))
(segment (start 226.521979 118.410021) (end 226.522001 118.409999) (width 0.25) (layer F.Cu) (net 73))
(segment (start 224.663001 117.638) (end 225.435021 118.410021) (width 0.25) (layer F.Cu) (net 73))
(via (at 226.822 118.11) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 73))
(segment (start 230.631999 124.714) (end 231.267 125.349) (width 0.25) (layer F.Cu) (net 74))
(segment (start 231.267 125.349) (end 231.267 127.254) (width 0.25) (layer F.Cu) (net 74))
(segment (start 225.789 124.714) (end 230.631999 124.714) (width 0.25) (layer F.Cu) (net 74))
(segment (start 224.663 122.588) (end 224.663 123.588) (width 0.25) (layer F.Cu) (net 74))
(segment (start 224.663 123.588) (end 225.789 124.714) (width 0.25) (layer F.Cu) (net 74))
(segment (start 206.883 122.842001) (end 206.883 129.27057) (width 0.25) (layer F.Cu) (net 75))
(segment (start 206.883 129.27057) (end 207.40643 129.794) (width 0.25) (layer F.Cu) (net 75))
(segment (start 207.40643 129.794) (end 208.407 129.794) (width 0.25) (layer F.Cu) (net 75))
(segment (start 208.407 129.794) (end 208.758447 129.794) (width 0.25) (layer F.Cu) (net 75))
(segment (start 209.677 127.254) (end 208.615534 127.254) (width 0.25) (layer F.Cu) (net 76))
(segment (start 208.615534 127.254) (end 208.153 126.791466) (width 0.25) (layer F.Cu) (net 76))
(segment (start 208.153 126.791466) (end 208.153 122.842) (width 0.25) (layer F.Cu) (net 76))
(segment (start 210.947 129.794) (end 209.851429 130.889571) (width 0.25) (layer F.Cu) (net 77))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 203.3905 124.46) (end 202.184 124.46) (width 0.25) (layer F.Cu) (net 77))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 209.851429 130.889571) (end 206.835571 130.889571) (width 0.25) (layer F.Cu) (net 77))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 206.248 127.3175) (end 203.3905 124.46) (width 0.25) (layer F.Cu) (net 77))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 202.184 124.46) (end 201.803 124.079) (width 0.25) (layer F.Cu) (net 77))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 206.835571 130.889571) (end 206.248 130.302) (width 0.25) (layer F.Cu) (net 77))
(segment (start 206.248 130.302) (end 206.248 127.3175) (width 0.25) (layer F.Cu) (net 77))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 201.803 124.079) (end 201.803 122.842) (width 0.25) (layer F.Cu) (net 77))
(segment (start 212.217 127.254) (end 212.217 125.984001) (width 0.25) (layer F.Cu) (net 78))
(segment (start 212.217 125.984001) (end 212.852 125.349) (width 0.25) (layer F.Cu) (net 78))
(segment (start 212.852 125.349) (end 212.852 121.158) (width 0.25) (layer F.Cu) (net 78))
(segment (start 212.852 121.158) (end 214.884 119.126) (width 0.25) (layer F.Cu) (net 78))
(segment (start 218.313 117.637999) (end 218.313 117.187999) (width 0.25) (layer F.Cu) (net 78))
(segment (start 214.884 119.126) (end 216.825 119.126) (width 0.25) (layer F.Cu) (net 78))
(segment (start 216.825 119.126) (end 218.313 117.637999) (width 0.25) (layer F.Cu) (net 78))
(segment (start 218.313 117.556534) (end 218.313 117.187999) (width 0.25) (layer F.Cu) (net 78))
(segment (start 213.487 129.794) (end 213.487 121.285) (width 0.25) (layer F.Cu) (net 79))
(segment (start 213.487 121.285) (end 214.884 119.888) (width 0.25) (layer F.Cu) (net 79))
(segment (start 214.884 119.888) (end 217.834695 119.888) (width 0.25) (layer F.Cu) (net 79))
(segment (start 217.834695 119.888) (end 219.033 118.689695) (width 0.25) (layer F.Cu) (net 79))
(segment (start 219.033 118.689695) (end 219.033 118.188) (width 0.25) (layer F.Cu) (net 79))
(segment (start 219.583 117.638) (end 219.583 117.188) (width 0.25) (layer F.Cu) (net 79))
(segment (start 219.033 118.188) (end 219.583 117.638) (width 0.25) (layer F.Cu) (net 79))
(segment (start 200.533 122.842001) (end 200.533 124.587) (width 0.25) (layer F.Cu) (net 80))
(segment (start 200.533 124.587) (end 200.914 124.968) (width 0.25) (layer F.Cu) (net 80))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 200.914 124.968) (end 203.1365 124.968) (width 0.25) (layer F.Cu) (net 80))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 206.289582 131.359582) (end 214.080418 131.359582) (width 0.25) (layer F.Cu) (net 80))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 203.1365 124.968) (end 205.74 127.5715) (width 0.25) (layer F.Cu) (net 80))
(segment (start 205.74 127.5715) (end 205.74 130.81) (width 0.25) (layer F.Cu) (net 80))
(segment (start 205.74 130.81) (end 206.289582 131.359582) (width 0.25) (layer F.Cu) (net 80))
(segment (start 214.080418 131.359582) (end 214.757 130.683) (width 0.25) (layer F.Cu) (net 80))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 214.757 130.683) (end 214.757 127.254) (width 0.25) (layer F.Cu) (net 80))
(segment (start 191.643 129.794) (end 191.643 128.397) (width 0.25) (layer F.Cu) (net 81))
(segment (start 191.643 128.397) (end 190.627 127.381) (width 0.25) (layer F.Cu) (net 81))
(segment (start 190.627 127.381) (end 190.627 127.254) (width 0.25) (layer F.Cu) (net 81))
(segment (start 190.627 127.254) (end 190.627 122.842) (width 0.25) (layer F.Cu) (net 81))
(segment (start 191.897 122.842) (end 191.897 126.238) (width 0.25) (layer F.Cu) (net 82))
(segment (start 191.897 126.238) (end 192.913 127.254) (width 0.25) (layer F.Cu) (net 82))
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(segment (start 194.183 129.794) (end 195.326 130.937) (width 0.25) (layer F.Cu) (net 83))
(segment (start 195.326 130.937) (end 197.485 130.937) (width 0.25) (layer F.Cu) (net 83))
(segment (start 197.485 130.937) (end 197.993 130.429) (width 0.25) (layer F.Cu) (net 83))
(segment (start 197.993 130.429) (end 197.993 128.875446) (width 0.25) (layer F.Cu) (net 83))
(segment (start 197.993 128.875446) (end 199.136 127.732446) (width 0.25) (layer F.Cu) (net 83))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 199.136 127.732446) (end 199.136 121.412) (width 0.25) (layer F.Cu) (net 83))
(segment (start 199.136 121.412) (end 199.644 120.904) (width 0.25) (layer F.Cu) (net 83))
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(segment (start 199.644 120.904) (end 203.2 120.904) (width 0.25) (layer F.Cu) (net 83))
(segment (start 203.2 120.904) (end 204.47 119.634) (width 0.25) (layer F.Cu) (net 83))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 204.47 119.634) (end 209.804 119.634) (width 0.25) (layer F.Cu) (net 83))
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(segment (start 209.804 119.634) (end 210.312 119.126) (width 0.25) (layer F.Cu) (net 83))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 210.312 119.126) (end 210.312 116.659998) (width 0.25) (layer F.Cu) (net 83))
(segment (start 210.312 116.659998) (end 209.730002 116.078) (width 0.25) (layer F.Cu) (net 83))
(segment (start 209.730002 116.078) (end 208.517 116.078) (width 0.25) (layer F.Cu) (net 83))
(segment (start 208.517 116.078) (end 208.153 116.442) (width 0.25) (layer F.Cu) (net 83))
(segment (start 208.153 116.442) (end 208.153001 117.442) (width 0.25) (layer F.Cu) (net 83))
(segment (start 198.12 119.38) (end 200.864999 119.38) (width 0.25) (layer F.Cu) (net 84))
(segment (start 197.612001 124.714) (end 197.612 119.888) (width 0.25) (layer F.Cu) (net 84))
(segment (start 197.612 119.888) (end 198.12 119.38) (width 0.25) (layer F.Cu) (net 84))
(segment (start 196.596001 125.73) (end 197.612001 124.714) (width 0.25) (layer F.Cu) (net 84))
(segment (start 196.088 125.73) (end 196.596001 125.73) (width 0.25) (layer F.Cu) (net 84))
(segment (start 195.453 127.254) (end 195.453 126.365) (width 0.25) (layer F.Cu) (net 84))
(segment (start 195.453 126.365) (end 196.088 125.73) (width 0.25) (layer F.Cu) (net 84))
(segment (start 200.864999 119.38) (end 201.803 118.442) (width 0.25) (layer F.Cu) (net 84))
(segment (start 201.803 118.442) (end 201.803001 117.442) (width 0.25) (layer F.Cu) (net 84))
(segment (start 203.073 117.442) (end 203.073 119.253) (width 0.25) (layer F.Cu) (net 85))
(segment (start 203.073 119.253) (end 202.438 119.888) (width 0.25) (layer F.Cu) (net 85))
(segment (start 202.438 119.888) (end 198.374 119.888) (width 0.25) (layer F.Cu) (net 85))
(segment (start 198.374 119.888) (end 198.12 120.142) (width 0.25) (layer F.Cu) (net 85))
(segment (start 198.12 120.142) (end 198.12 125.095) (width 0.25) (layer F.Cu) (net 85))
(segment (start 198.12 125.095) (end 196.723 126.491999) (width 0.25) (layer F.Cu) (net 85))
(segment (start 196.723 126.491999) (end 196.723 129.794) (width 0.25) (layer F.Cu) (net 85))
(segment (start 198.882 120.396) (end 202.946 120.396) (width 0.25) (layer F.Cu) (net 86))
(segment (start 198.628 125.557535) (end 198.628 120.65) (width 0.25) (layer F.Cu) (net 86))
(segment (start 198.628 120.65) (end 198.882 120.396) (width 0.25) (layer F.Cu) (net 86))
(segment (start 197.993 127.254) (end 197.993 126.192534) (width 0.25) (layer F.Cu) (net 86))
(segment (start 197.993 126.192534) (end 198.628 125.557535) (width 0.25) (layer F.Cu) (net 86))
(segment (start 204.216 119.126) (end 208.915 119.126) (width 0.25) (layer F.Cu) (net 86))
(segment (start 202.946 120.396) (end 204.216 119.126) (width 0.25) (layer F.Cu) (net 86))
(segment (start 208.915 119.126) (end 209.423 118.618) (width 0.25) (layer F.Cu) (net 86))
(segment (start 209.423 118.618) (end 209.423 117.442) (width 0.25) (layer F.Cu) (net 86))
(segment (start 186.817 117.442) (end 186.817 118.745) (width 0.25) (layer F.Cu) (net 87))
(segment (start 186.817 118.745) (end 185.166 120.396) (width 0.25) (layer F.Cu) (net 87))
(segment (start 185.166 120.396) (end 182.88 120.396) (width 0.25) (layer F.Cu) (net 87))
(segment (start 182.88 120.396) (end 182.118001 121.157999) (width 0.25) (layer F.Cu) (net 87))
(segment (start 182.118001 121.157999) (end 182.118001 123.698) (width 0.25) (layer F.Cu) (net 87))
(segment (start 177.8 126.521694) (end 177.8 127.478447) (width 0.25) (layer F.Cu) (net 87))
(segment (start 182.118001 123.698) (end 181.102001 124.714) (width 0.25) (layer F.Cu) (net 87))
(segment (start 175.484447 129.794) (end 175.133 129.794) (width 0.25) (layer F.Cu) (net 87))
(segment (start 181.102001 124.714) (end 179.607694 124.714) (width 0.25) (layer F.Cu) (net 87))
(segment (start 179.607694 124.714) (end 177.8 126.521694) (width 0.25) (layer F.Cu) (net 87))
(segment (start 177.8 127.478447) (end 175.484447 129.794) (width 0.25) (layer F.Cu) (net 87))
(segment (start 185.547 117.442) (end 185.547 118.745) (width 0.25) (layer F.Cu) (net 88))
(segment (start 184.404 119.888) (end 182.372 119.888) (width 0.25) (layer F.Cu) (net 88))
(segment (start 181.61 120.65) (end 181.61 123.444) (width 0.25) (layer F.Cu) (net 88))
(segment (start 185.547 118.745) (end 184.404 119.888) (width 0.25) (layer F.Cu) (net 88))
(segment (start 178.054 125.603) (end 176.403 127.254) (width 0.25) (layer F.Cu) (net 88))
(segment (start 182.372 119.888) (end 181.61 120.65) (width 0.25) (layer F.Cu) (net 88))
(segment (start 181.61 123.444) (end 180.848 124.206) (width 0.25) (layer F.Cu) (net 88))
(segment (start 180.848 124.206) (end 179.451 124.206) (width 0.25) (layer F.Cu) (net 88))
(segment (start 179.451 124.206) (end 178.054 125.603) (width 0.25) (layer F.Cu) (net 88))
(segment (start 177.673 129.794) (end 178.768571 130.889571) (width 0.25) (layer F.Cu) (net 89))
(segment (start 178.768571 130.889571) (end 180.738875 130.889571) (width 0.25) (layer F.Cu) (net 89))
(segment (start 180.738875 130.889571) (end 181.308571 130.319875) (width 0.25) (layer F.Cu) (net 89))
(segment (start 181.308571 130.319875) (end 181.308571 129.049875) (width 0.25) (layer F.Cu) (net 89))
(segment (start 181.308571 129.049875) (end 182.927429 127.431017) (width 0.25) (layer F.Cu) (net 89))
(segment (start 182.927429 127.431017) (end 182.927429 126.728125) (width 0.25) (layer F.Cu) (net 89))
(segment (start 185.547 124.108554) (end 185.547 122.842) (width 0.25) (layer F.Cu) (net 89))
(segment (start 182.927429 126.728125) (end 185.547 124.108554) (width 0.25) (layer F.Cu) (net 89))
(segment (start 178.943 127.254) (end 179.693569 126.503431) (width 0.25) (layer F.Cu) (net 90))
(segment (start 181.864 125.222) (end 182.626 124.46) (width 0.25) (layer F.Cu) (net 90))
(segment (start 187.198 119.126) (end 192.913 119.126) (width 0.25) (layer F.Cu) (net 90))
(segment (start 179.693569 126.503431) (end 179.693569 126.122432) (width 0.25) (layer F.Cu) (net 90))
(segment (start 179.693569 126.122432) (end 180.594 125.222) (width 0.25) (layer F.Cu) (net 90))
(segment (start 192.913 119.126) (end 193.167 118.872) (width 0.25) (layer F.Cu) (net 90))
(segment (start 180.594 125.222) (end 181.864 125.222) (width 0.25) (layer F.Cu) (net 90))
(segment (start 182.626 124.46) (end 182.626 121.412) (width 0.25) (layer F.Cu) (net 90))
(segment (start 183.134 120.904) (end 185.42 120.904) (width 0.25) (layer F.Cu) (net 90))
(segment (start 185.42 120.904) (end 187.198 119.126) (width 0.25) (layer F.Cu) (net 90))
(segment (start 182.626 121.412) (end 183.134 120.904) (width 0.25) (layer F.Cu) (net 90))
(segment (start 193.167 118.872) (end 193.166999 117.442) (width 0.25) (layer F.Cu) (net 90))
(segment (start 191.897 117.442) (end 191.897 116.442) (width 0.25) (layer F.Cu) (net 91))
(segment (start 192.261 116.078) (end 193.802 116.078) (width 0.25) (layer F.Cu) (net 91))
(segment (start 185.674 121.412) (end 183.642 121.412) (width 0.25) (layer F.Cu) (net 91))
(segment (start 183.134001 121.919999) (end 183.134001 124.714) (width 0.25) (layer F.Cu) (net 91))
(segment (start 182.118001 125.73) (end 180.975 125.730001) (width 0.25) (layer F.Cu) (net 91))
(segment (start 191.897 116.442) (end 192.261 116.078) (width 0.25) (layer F.Cu) (net 91))
(segment (start 187.452 119.634) (end 185.674 121.412) (width 0.25) (layer F.Cu) (net 91))
(segment (start 183.642 121.412) (end 183.134001 121.919999) (width 0.25) (layer F.Cu) (net 91))
(segment (start 193.802 116.078) (end 194.056 116.332) (width 0.25) (layer F.Cu) (net 91))
(segment (start 193.294 119.634) (end 187.452 119.634) (width 0.25) (layer F.Cu) (net 91))
(segment (start 194.056 116.332) (end 194.056 118.872) (width 0.25) (layer F.Cu) (net 91))
(segment (start 194.056 118.872) (end 193.294 119.634) (width 0.25) (layer F.Cu) (net 91))
(segment (start 183.134001 124.714) (end 182.118001 125.73) (width 0.25) (layer F.Cu) (net 91))
(segment (start 180.213001 126.492) (end 180.213 129.794) (width 0.25) (layer F.Cu) (net 91))
(segment (start 180.975 125.730001) (end 180.213001 126.492) (width 0.25) (layer F.Cu) (net 91))
(segment (start 181.483 127.254) (end 184.277001 124.46) (width 0.25) (layer F.Cu) (net 92))
(segment (start 184.277001 124.46) (end 184.277 122.842001) (width 0.25) (layer F.Cu) (net 92))
(segment (start 228.854 115.062) (end 227.33 113.538) (width 0.25) (layer F.Cu) (net 93))
(segment (start 228.854 119.38) (end 228.854 115.062) (width 0.25) (layer F.Cu) (net 93))
(segment (start 227.33 113.538) (end 221.488 113.538001) (width 0.25) (layer F.Cu) (net 93))
(segment (start 219.583001 122.588) (end 219.583 121.588) (width 0.25) (layer F.Cu) (net 93))
(segment (start 219.583 121.588) (end 220.775 120.396) (width 0.25) (layer F.Cu) (net 93))
(segment (start 220.775 120.396) (end 227.838 120.396) (width 0.25) (layer F.Cu) (net 93))
(segment (start 227.838 120.396) (end 228.854 119.38) (width 0.25) (layer F.Cu) (net 93))
(segment (start 219.705 111.755) (end 219.705 107.362) (width 0.25) (layer F.Cu) (net 93))
(segment (start 221.488 113.538001) (end 219.705 111.755) (width 0.25) (layer F.Cu) (net 93))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 214.975 107.362) (end 214.975 113.121001) (width 0.25) (layer F.Cu) (net 94))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 221.234 115.570001) (end 223.139 115.57) (width 0.25) (layer F.Cu) (net 94))
(segment (start 223.139 115.57) (end 223.393 115.824) (width 0.25) (layer F.Cu) (net 94))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 214.975 113.121001) (end 216.153999 114.3) (width 0.25) (layer F.Cu) (net 94))
(segment (start 216.153999 114.3) (end 216.662 114.3) (width 0.25) (layer F.Cu) (net 94))
(segment (start 216.662 114.3) (end 217.424 115.062) (width 0.25) (layer F.Cu) (net 94))
(segment (start 217.424 115.062) (end 220.726 115.062) (width 0.25) (layer F.Cu) (net 94))
(segment (start 220.726 115.062) (end 221.234 115.570001) (width 0.25) (layer F.Cu) (net 94))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 223.393 115.824) (end 223.393 117.188) (width 0.25) (layer F.Cu) (net 94))
(segment (start 208.974999 113.725) (end 211.328 116.078) (width 0.25) (layer F.Cu) (net 95))
(segment (start 208.975 107.362) (end 208.974999 113.725) (width 0.25) (layer F.Cu) (net 95))
(segment (start 211.328 116.078) (end 211.328 119.888) (width 0.25) (layer F.Cu) (net 95))
(segment (start 211.328 119.888) (end 210.566 120.65) (width 0.25) (layer F.Cu) (net 95))
(segment (start 210.566 120.65) (end 205.74 120.650001) (width 0.25) (layer F.Cu) (net 95))
(segment (start 205.74 120.650001) (end 205.613 120.777001) (width 0.25) (layer F.Cu) (net 95))
(segment (start 205.613 120.777001) (end 205.613 122.842) (width 0.25) (layer F.Cu) (net 95))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 229.648 60.579) (end 229.648 57.3725) (width 0.25) (layer F.Cu) (net 96))
(segment (start 229.648 57.3725) (end 229.616 57.3405) (width 0.25) (layer F.Cu) (net 96))
(segment (start 229.616 51.943) (end 229.616 50.673) (width 0.25) (layer F.Cu) (net 96))
(segment (start 229.648 53.594) (end 229.648 51.975) (width 0.25) (layer F.Cu) (net 96))
(segment (start 229.648 51.975) (end 229.616 51.943) (width 0.25) (layer F.Cu) (net 96))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 230.4415 98.552) (end 230.4415 96.774) (width 0.5) (layer B.Cu) (net 96))
(segment (start 227.965 99.441) (end 228.854 98.552) (width 0.5) (layer B.Cu) (net 96))
(segment (start 228.854 98.552) (end 230.4415 98.552) (width 0.5) (layer B.Cu) (net 96))
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routed some more.
2015-11-17 16:48:00 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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(segment (start 187.706 120.142) (end 186.817 121.031) (width 0.25) (layer F.Cu) (net 104))
(segment (start 193.802 120.142) (end 187.706 120.142) (width 0.25) (layer F.Cu) (net 104))
(segment (start 194.818 119.126) (end 193.802 120.142) (width 0.25) (layer F.Cu) (net 104))
(segment (start 195.705 112.776) (end 194.818 113.663) (width 0.25) (layer F.Cu) (net 104))
(segment (start 189.705 114.017602) (end 188.087 115.635602) (width 0.25) (layer F.Cu) (net 105))
(segment (start 189.705 107.362) (end 189.705 114.017602) (width 0.25) (layer F.Cu) (net 105))
(segment (start 188.087 116.442) (end 188.087 117.442) (width 0.25) (layer F.Cu) (net 105))
(segment (start 188.087 115.635602) (end 188.087 116.442) (width 0.25) (layer F.Cu) (net 105))
(segment (start 189.705 107.362) (end 189.665001 107.401999) (width 0.25) (layer F.Cu) (net 105))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 194.564 59.436) (end 221.361 59.436) (width 0.25) (layer F.Cu) (net 107))
(segment (start 222.219519 55.118) (end 222.219519 58.577481) (width 0.25) (layer F.Cu) (net 107))
(segment (start 222.219519 58.577481) (end 221.361 59.436) (width 0.25) (layer F.Cu) (net 107))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 173.675001 62.662) (end 174.182979 62.154022) (width 0.25) (layer F.Cu) (net 107))
(segment (start 174.182979 62.154022) (end 191.845978 62.154022) (width 0.25) (layer F.Cu) (net 107))
(segment (start 191.845978 62.154022) (end 194.564 59.436) (width 0.25) (layer F.Cu) (net 107))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 223.489519 52.578) (end 223.489519 59.212481) (width 0.25) (layer F.Cu) (net 108))
(segment (start 223.489519 59.212481) (end 222.758 59.944) (width 0.25) (layer F.Cu) (net 108))
(segment (start 222.758 59.944) (end 194.818 59.944) (width 0.25) (layer F.Cu) (net 108))
(segment (start 194.818 59.944) (end 192.1 62.662) (width 0.25) (layer F.Cu) (net 108))
(segment (start 192.1 62.662) (end 174.945001 62.662) (width 0.25) (layer F.Cu) (net 108))
(segment (start 185.801 58.166) (end 172.555084 58.166) (width 0.25) (layer F.Cu) (net 111))
(segment (start 172.555084 58.166) (end 171.780052 58.941033) (width 0.25) (layer F.Cu) (net 111))
(segment (start 170.726063 59.487022) (end 164.374978 59.487022) (width 0.25) (layer F.Cu) (net 111))
(segment (start 171.272052 58.941033) (end 170.726063 59.487022) (width 0.25) (layer F.Cu) (net 111))
(segment (start 171.780052 58.941033) (end 171.272052 58.941033) (width 0.25) (layer F.Cu) (net 111))
(segment (start 188.849 55.118) (end 185.801 58.166) (width 0.25) (layer F.Cu) (net 111))
(segment (start 164.374978 59.487022) (end 161.675 62.187) (width 0.25) (layer F.Cu) (net 111))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 161.675 63.424) (end 161.675 62.187) (width 0.25) (layer F.Cu) (net 111))
(segment (start 161.675 62.187) (end 161.675 62.662) (width 0.25) (layer F.Cu) (net 111))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 172.71178 58.674) (end 188.849 58.674) (width 0.25) (layer F.Cu) (net 112))
(segment (start 190.119 57.404) (end 190.119 53.57857) (width 0.25) (layer F.Cu) (net 112))
(segment (start 188.849 58.674) (end 190.119 57.404) (width 0.25) (layer F.Cu) (net 112))
(segment (start 170.920747 59.957033) (end 171.466736 59.411044) (width 0.25) (layer F.Cu) (net 112))
(segment (start 190.119 53.57857) (end 190.119 52.578) (width 0.25) (layer F.Cu) (net 112))
(segment (start 165.649967 59.957033) (end 170.920747 59.957033) (width 0.25) (layer F.Cu) (net 112))
(segment (start 162.945 62.662) (end 165.649967 59.957033) (width 0.25) (layer F.Cu) (net 112))
(segment (start 171.974736 59.411044) (end 172.71178 58.674) (width 0.25) (layer F.Cu) (net 112))
(segment (start 171.466736 59.411044) (end 171.974736 59.411044) (width 0.25) (layer F.Cu) (net 112))
(segment (start 149.675 63.424) (end 149.675 61.272) (width 0.25) (layer F.Cu) (net 115))
(segment (start 149.675 61.272) (end 153.035 57.912) (width 0.25) (layer F.Cu) (net 115))
(segment (start 153.035 57.912) (end 155.829 55.118) (width 0.25) (layer F.Cu) (net 115))
(segment (start 155.956 57.658) (end 157.099 56.515) (width 0.25) (layer F.Cu) (net 116))
(segment (start 157.099 56.515) (end 157.099 52.578) (width 0.25) (layer F.Cu) (net 116))
(segment (start 154.94 57.658) (end 155.956 57.658) (width 0.25) (layer F.Cu) (net 116))
(segment (start 150.945 61.653) (end 154.94 57.658) (width 0.25) (layer F.Cu) (net 116))
(segment (start 150.945 63.424) (end 150.945 61.653) (width 0.25) (layer F.Cu) (net 116))
(segment (start 168.969934 61.367066) (end 171.504799 61.367066) (width 0.25) (layer F.Cu) (net 119))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 189.992 60.198) (end 192.786 57.404) (width 0.25) (layer F.Cu) (net 119))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 192.786 57.404) (end 203.2381 57.404) (width 0.25) (layer F.Cu) (net 119))
(segment (start 204.773531 55.868569) (end 205.5241 55.118) (width 0.25) (layer F.Cu) (net 119))
(segment (start 172.558788 60.821077) (end 173.181865 60.198) (width 0.25) (layer F.Cu) (net 119))
(segment (start 172.050787 60.821077) (end 172.558788 60.821077) (width 0.25) (layer F.Cu) (net 119))
(segment (start 171.504799 61.367066) (end 172.050787 60.821077) (width 0.25) (layer F.Cu) (net 119))
(segment (start 203.2381 57.404) (end 204.773531 55.868569) (width 0.25) (layer F.Cu) (net 119))
(segment (start 173.181865 60.198) (end 189.992 60.198) (width 0.25) (layer F.Cu) (net 119))
(segment (start 167.675 62.662) (end 168.969934 61.367066) (width 0.25) (layer F.Cu) (net 119))
(segment (start 206.7941 56.9341) (end 206.7941 53.57857) (width 0.25) (layer F.Cu) (net 120))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 190.5 60.706) (end 193.294 57.912) (width 0.25) (layer F.Cu) (net 120))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 205.8162 57.912) (end 206.7941 56.9341) (width 0.25) (layer F.Cu) (net 120))
(segment (start 193.294 57.912) (end 205.8162 57.912) (width 0.25) (layer F.Cu) (net 120))
(segment (start 169.769923 61.837077) (end 171.699483 61.837077) (width 0.25) (layer F.Cu) (net 120))
(segment (start 173.33856 60.706) (end 190.5 60.706) (width 0.25) (layer F.Cu) (net 120))
(segment (start 172.753472 61.291088) (end 173.33856 60.706) (width 0.25) (layer F.Cu) (net 120))
(segment (start 172.245472 61.291088) (end 172.753472 61.291088) (width 0.25) (layer F.Cu) (net 120))
(segment (start 168.945 62.662) (end 169.769923 61.837077) (width 0.25) (layer F.Cu) (net 120))
(segment (start 206.7941 53.57857) (end 206.7941 52.578) (width 0.25) (layer F.Cu) (net 120))
(segment (start 171.699483 61.837077) (end 172.245472 61.291088) (width 0.25) (layer F.Cu) (net 120))
(segment (start 172.339 55.118) (end 169.940694 57.516306) (width 0.25) (layer F.Cu) (net 123))
(segment (start 169.940694 57.516306) (end 161.163 57.516306) (width 0.25) (layer F.Cu) (net 123))
(segment (start 161.163 57.516306) (end 155.675001 63.004305) (width 0.25) (layer F.Cu) (net 123))
(segment (start 155.675001 63.004305) (end 155.675001 63.424) (width 0.25) (layer F.Cu) (net 123))
(segment (start 156.945001 63.424) (end 156.945001 62.949) (width 0.25) (layer F.Cu) (net 124))
(segment (start 156.945001 62.949) (end 161.855001 58.039) (width 0.25) (layer F.Cu) (net 124))
(segment (start 161.855001 58.039) (end 170.18 58.039) (width 0.25) (layer F.Cu) (net 124))
(segment (start 170.18 58.039) (end 171.704 56.515) (width 0.25) (layer F.Cu) (net 124))
(segment (start 171.704 56.515) (end 173.101 56.515) (width 0.25) (layer F.Cu) (net 124))
(segment (start 173.101 56.515) (end 173.609 56.007) (width 0.25) (layer F.Cu) (net 124))
(segment (start 173.609 56.007) (end 173.609 53.57857) (width 0.25) (layer F.Cu) (net 124))
(segment (start 173.609 53.57857) (end 173.609 52.578) (width 0.25) (layer F.Cu) (net 124))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 156.945001 62.662) (end 156.945001 63.687) (width 0.25) (layer F.Cu) (net 124))
Major routing done
2015-11-22 00:17:10 +00:00
(segment (start 233.045 94.742) (end 232.537 94.234) (width 0.5) (layer F.Cu) (net 126))
(segment (start 232.537 94.234) (end 230.4415 94.234) (width 0.5) (layer F.Cu) (net 126))
(segment (start 233.045 101.0285) (end 233.045 94.742) (width 0.5) (layer F.Cu) (net 126))
(segment (start 234.061 102.0445) (end 233.045 101.0285) (width 0.5) (layer F.Cu) (net 126))
(segment (start 235.228 102.0445) (end 234.061 102.0445) (width 0.5) (layer F.Cu) (net 126))
(segment (start 234.188 95.57131) (end 234.188 99.2545) (width 0.5) (layer F.Cu) (net 126))
(segment (start 234.188 99.2545) (end 235.228 100.2945) (width 0.5) (layer F.Cu) (net 126))
(segment (start 235.228 100.2945) (end 235.228 102.0445) (width 0.5) (layer F.Cu) (net 126))
(segment (start 236.982 93.52788) (end 236.23143 93.52788) (width 0.5) (layer F.Cu) (net 126))
(segment (start 236.23143 93.52788) (end 234.188 95.57131) (width 0.5) (layer F.Cu) (net 126))
(segment (start 236.982 93.52788) (end 239.23206 93.52788) (width 0.5) (layer F.Cu) (net 126))
(segment (start 239.23206 93.52788) (end 240.157 92.60294) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.157 92.60294) (end 240.157 92.35294) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.157 59.436) (end 240.157 52.959) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.157 52.959) (end 240.157 52.3875) (width 0.5) (layer F.Cu) (net 126))
(segment (start 236.982 45.465999) (end 237.73257 45.465999) (width 0.5) (layer F.Cu) (net 126))
(segment (start 237.73257 45.465999) (end 240.157 47.890429) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.157 47.890429) (end 240.157 52.959) (width 0.5) (layer F.Cu) (net 126))
(segment (start 236.982 52.466239) (end 240.078261 52.466239) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.078261 52.466239) (end 240.157 52.3875) (width 0.5) (layer F.Cu) (net 126))
(segment (start 236.982 59.466479) (end 240.126521 59.466479) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.157 92.35294) (end 240.157 59.436) (width 0.5) (layer F.Cu) (net 126))
(segment (start 240.157 59.436) (end 240.126521 59.466479) (width 0.25) (layer F.Cu) (net 126))
(segment (start 240.157 52.3875) (end 240.157 47.890429) (width 0.25) (layer F.Cu) (net 126))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 231.648 62.992) (end 231.648 60.579) (width 0.25) (layer F.Cu) (net 127))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 231.648 62.992) (end 236.956599 62.992) (width 0.25) (layer F.Cu) (net 127))
(segment (start 236.956599 62.992) (end 236.982 62.966599) (width 0.25) (layer F.Cu) (net 127))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 231.648 55.88) (end 231.648 53.594) (width 0.25) (layer F.Cu) (net 128))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 231.648 55.88) (end 236.895641 55.88) (width 0.25) (layer F.Cu) (net 128))
(segment (start 236.895641 55.88) (end 236.982 55.966359) (width 0.25) (layer F.Cu) (net 128))
Swapped RX/TX
2015-11-30 23:46:52 +00:00
(segment (start 231.616 51.943) (end 231.616 49.054) (width 0.25) (layer F.Cu) (net 129))
(segment (start 231.616 49.054) (end 231.648 49.022) (width 0.25) (layer F.Cu) (net 129))
routed some more.
2015-11-17 16:48:00 +00:00
(segment (start 231.648 49.022) (end 236.926119 49.022) (width 0.25) (layer F.Cu) (net 129))
(segment (start 236.926119 49.022) (end 236.982 48.966119) (width 0.25) (layer F.Cu) (net 129))
Final version.
2015-11-29 23:35:28 +00:00
(segment (start 164.097057 128.528) (end 163.576 128.528) (width 0.25) (layer F.Cu) (net 130))
(segment (start 172.695044 119.930013) (end 164.097057 128.528) (width 0.25) (layer F.Cu) (net 130))
(segment (start 172.695044 114.553556) (end 172.695044 119.930013) (width 0.25) (layer F.Cu) (net 130))
(segment (start 174.0916 113.157) (end 172.695044 114.553556) (width 0.25) (layer F.Cu) (net 130))
(segment (start 174.244 113.157) (end 174.0916 113.157) (width 0.25) (layer F.Cu) (net 130))
(segment (start 163.576 129.54) (end 163.576 128.528) (width 0.25) (layer F.Cu) (net 130))
(segment (start 163.576 128.528) (end 163.58 128.524) (width 0.25) (layer F.Cu) (net 130))
(segment (start 171.755022 118.566978) (end 171.755022 110.413578) (width 0.25) (layer F.Cu) (net 131))
(segment (start 174.0916 108.077) (end 174.244 108.077) (width 0.25) (layer F.Cu) (net 131))
(segment (start 163.576 126.746) (end 171.755022 118.566978) (width 0.25) (layer F.Cu) (net 131))
(segment (start 171.755022 110.413578) (end 174.0916 108.077) (width 0.25) (layer F.Cu) (net 131))
(segment (start 170.815 106.426) (end 174.244 102.997) (width 0.25) (layer F.Cu) (net 132))
(segment (start 170.815 116.713) (end 170.815 106.426) (width 0.25) (layer F.Cu) (net 132))
(segment (start 163.576 123.952) (end 170.815 116.713) (width 0.25) (layer F.Cu) (net 132))
(segment (start 164.107361 127.853001) (end 162.149629 127.853001) (width 0.25) (layer F.Cu) (net 133))
(segment (start 172.225033 112.483567) (end 172.225033 119.735329) (width 0.25) (layer F.Cu) (net 133))
(segment (start 174.0916 110.617) (end 172.225033 112.483567) (width 0.25) (layer F.Cu) (net 133))
(segment (start 162.149629 127.853001) (end 161.85963 128.143) (width 0.25) (layer F.Cu) (net 133))
(segment (start 174.244 110.617) (end 174.0916 110.617) (width 0.25) (layer F.Cu) (net 133))
(segment (start 161.85963 128.143) (end 160.782 128.143) (width 0.25) (layer F.Cu) (net 133))
(segment (start 172.225033 119.735329) (end 164.107361 127.853001) (width 0.25) (layer F.Cu) (net 133))
(segment (start 160.782 125.349) (end 163.957 125.349) (width 0.25) (layer F.Cu) (net 134))
(segment (start 171.285011 118.020989) (end 171.285011 108.343589) (width 0.25) (layer F.Cu) (net 134))
(segment (start 171.285011 108.343589) (end 174.0916 105.537) (width 0.25) (layer F.Cu) (net 134))
(segment (start 174.0916 105.537) (end 174.244 105.537) (width 0.25) (layer F.Cu) (net 134))
(segment (start 163.957 125.349) (end 171.285011 118.020989) (width 0.25) (layer F.Cu) (net 134))
Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
(segment (start 171.069 67.31) (end 172.555011 65.823989) (width 0.25) (layer B.Cu) (net 135))
(segment (start 172.555011 65.823989) (end 185.382011 65.823989) (width 0.25) (layer B.Cu) (net 135))
(segment (start 185.382011 65.823989) (end 191.516 59.69) (width 0.25) (layer B.Cu) (net 135))
(segment (start 191.516 59.69) (end 206.375 59.69) (width 0.25) (layer B.Cu) (net 135))
(segment (start 213.487 52.578) (end 214.808053 52.578) (width 0.25) (layer B.Cu) (net 135))
(segment (start 206.375 59.69) (end 213.487 52.578) (width 0.25) (layer B.Cu) (net 135))
(segment (start 214.808053 52.578) (end 215.869519 52.578) (width 0.25) (layer B.Cu) (net 135))
(segment (start 171.135001 67.376001) (end 171.069 67.31) (width 0.25) (layer F.Cu) (net 135))
(segment (start 171.135001 68.824) (end 171.135001 67.376001) (width 0.25) (layer F.Cu) (net 135))
(via (at 171.069 67.31) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 135))
(segment (start 171.135 74.598) (end 171.135 72.210999) (width 0.25) (layer F.Cu) (net 135))
(segment (start 171.135001 68.824) (end 171.135001 71.401) (width 0.25) (layer F.Cu) (net 135))
(segment (start 171.135 72.210999) (end 171.54 71.805999) (width 0.25) (layer F.Cu) (net 135))
(segment (start 171.135001 71.401) (end 171.54 71.805999) (width 0.25) (layer F.Cu) (net 135))
(segment (start 171.135001 70.957) (end 171.54 71.362) (width 0.25) (layer F.Cu) (net 135))
(segment (start 171.135 71.703) (end 171.539999 71.298) (width 0.25) (layer F.Cu) (net 135))
(segment (start 175.006 67.31) (end 176.022 66.294) (width 0.25) (layer B.Cu) (net 136))
(segment (start 176.022 66.294) (end 185.801 66.294) (width 0.25) (layer B.Cu) (net 136))
(segment (start 185.801 66.294) (end 191.77 60.325) (width 0.25) (layer B.Cu) (net 136))
(segment (start 191.77 60.325) (end 209.392519 60.325) (width 0.25) (layer B.Cu) (net 136))
(segment (start 209.392519 60.325) (end 214.599519 55.118) (width 0.25) (layer B.Cu) (net 136))
(segment (start 174.945001 68.824) (end 174.945001 67.370999) (width 0.25) (layer F.Cu) (net 136))
(segment (start 174.945001 67.370999) (end 175.006 67.31) (width 0.25) (layer F.Cu) (net 136))
(via (at 175.006 67.31) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 136))
(segment (start 174.945 74.598) (end 174.945 72.210999) (width 0.25) (layer F.Cu) (net 136))
(segment (start 174.945 72.210999) (end 174.54 71.805999) (width 0.25) (layer F.Cu) (net 136))
(segment (start 174.945001 68.824) (end 174.945001 71.400998) (width 0.25) (layer F.Cu) (net 136))
(segment (start 174.945001 71.400998) (end 174.54 71.805999) (width 0.25) (layer F.Cu) (net 136))
(segment (start 174.945 70.956999) (end 174.54 71.362) (width 0.25) (layer F.Cu) (net 136))
(segment (start 174.945 71.703) (end 174.54 71.298) (width 0.25) (layer F.Cu) (net 136))
(segment (start 165.1 67.31) (end 167.64 64.77) (width 0.25) (layer B.Cu) (net 137))
(segment (start 167.64 64.77) (end 184.785 64.77) (width 0.25) (layer B.Cu) (net 137))
(segment (start 196.977 52.578) (end 198.112634 52.578) (width 0.25) (layer B.Cu) (net 137))
(segment (start 184.785 64.77) (end 196.977 52.578) (width 0.25) (layer B.Cu) (net 137))
(segment (start 198.112634 52.578) (end 199.1741 52.578) (width 0.25) (layer B.Cu) (net 137))
(segment (start 165.135 68.824) (end 165.135 67.345) (width 0.25) (layer F.Cu) (net 137))
(via (at 165.1 67.31) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 137))
(segment (start 165.135 67.345) (end 165.1 67.31) (width 0.25) (layer F.Cu) (net 137))
(segment (start 165.135 74.597999) (end 165.135 72.211) (width 0.25) (layer F.Cu) (net 137))
(segment (start 165.135 68.824) (end 165.135 71.401) (width 0.25) (layer F.Cu) (net 137))
(segment (start 165.135 72.211) (end 165.54 71.806) (width 0.25) (layer F.Cu) (net 137))
(segment (start 165.135 71.401) (end 165.54 71.806) (width 0.25) (layer F.Cu) (net 137))
(segment (start 165.135 70.957) (end 165.54 71.362) (width 0.25) (layer F.Cu) (net 137))
(segment (start 165.135001 71.703) (end 165.54 71.298) (width 0.25) (layer F.Cu) (net 137))
(segment (start 197.9041 55.118) (end 195.199 55.118) (width 0.25) (layer B.Cu) (net 138))
(segment (start 195.199 55.118) (end 185.039 65.278) (width 0.25) (layer B.Cu) (net 138))
(segment (start 185.039 65.278) (end 170.736011 65.278) (width 0.25) (layer B.Cu) (net 138))
(segment (start 170.736011 65.278) (end 169.209999 66.804012) (width 0.25) (layer B.Cu) (net 138))
(segment (start 169.209999 66.804012) (end 168.91 67.104011) (width 0.25) (layer B.Cu) (net 138))
(segment (start 168.945 67.139011) (end 168.91 67.104011) (width 0.25) (layer F.Cu) (net 138))
(segment (start 168.945 68.824) (end 168.945 67.139011) (width 0.25) (layer F.Cu) (net 138))
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(segment (start 168.945 71.401) (end 168.54 71.806) (width 0.25) (layer F.Cu) (net 138))
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(segment (start 159.131 67.31) (end 159.131 64.643) (width 0.25) (layer B.Cu) (net 139))
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(segment (start 166.116 60.706) (end 169.799 57.023) (width 0.25) (layer B.Cu) (net 139))
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(segment (start 175.514 57.023) (end 179.959 52.578) (width 0.25) (layer B.Cu) (net 139))
(segment (start 179.959 52.578) (end 181.437534 52.578) (width 0.25) (layer B.Cu) (net 139))
(segment (start 181.437534 52.578) (end 182.499 52.578) (width 0.25) (layer B.Cu) (net 139))
(segment (start 159.135 68.824) (end 159.135 67.314) (width 0.25) (layer F.Cu) (net 139))
(segment (start 159.135 67.314) (end 159.131 67.31) (width 0.25) (layer F.Cu) (net 139))
(via (at 159.131 67.31) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 139))
(segment (start 159.135 74.598) (end 159.135 72.211) (width 0.25) (layer F.Cu) (net 139))
(segment (start 159.135 72.211) (end 159.54 71.806) (width 0.25) (layer F.Cu) (net 139))
(segment (start 159.135 68.824) (end 159.135 71.401) (width 0.25) (layer F.Cu) (net 139))
(segment (start 159.135 71.401) (end 159.54 71.806) (width 0.25) (layer F.Cu) (net 139))
(segment (start 159.135 70.957) (end 159.54 71.362002) (width 0.25) (layer F.Cu) (net 139))
(segment (start 159.135 71.703) (end 159.54 71.298) (width 0.25) (layer F.Cu) (net 139))
(segment (start 162.941 67.31) (end 162.941 64.77) (width 0.25) (layer B.Cu) (net 140))
(segment (start 162.941 64.77) (end 170.18 57.531) (width 0.25) (layer B.Cu) (net 140))
(segment (start 170.18 57.531) (end 176.022 57.531) (width 0.25) (layer B.Cu) (net 140))
(segment (start 176.022 57.531) (end 178.435 55.118) (width 0.25) (layer B.Cu) (net 140))
(segment (start 178.435 55.118) (end 181.229 55.118) (width 0.25) (layer B.Cu) (net 140))
(segment (start 162.941 67.31) (end 162.941 68.82) (width 0.25) (layer F.Cu) (net 140))
(segment (start 162.941 68.82) (end 162.945 68.824) (width 0.25) (layer F.Cu) (net 140))
(via (at 162.941 67.31) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 140))
(segment (start 162.945 74.598) (end 162.945 72.211) (width 0.25) (layer F.Cu) (net 140))
(segment (start 162.945 72.211) (end 162.54 71.806) (width 0.25) (layer F.Cu) (net 140))
(segment (start 162.945 68.824) (end 162.945 71.401) (width 0.25) (layer F.Cu) (net 140))
(segment (start 162.945 71.401) (end 162.54 71.806) (width 0.25) (layer F.Cu) (net 140))
(segment (start 162.945 70.957) (end 162.54 71.362) (width 0.25) (layer F.Cu) (net 140))
(segment (start 162.945 71.703) (end 162.54 71.298) (width 0.25) (layer F.Cu) (net 140))
(segment (start 153.162 67.183) (end 153.162 64.343534) (width 0.25) (layer B.Cu) (net 141))
(segment (start 153.162 64.343534) (end 164.927534 52.578) (width 0.25) (layer B.Cu) (net 141))
(segment (start 164.927534 52.578) (end 165.989 52.578) (width 0.25) (layer B.Cu) (net 141))
(segment (start 153.135001 68.824) (end 153.135001 67.209999) (width 0.25) (layer F.Cu) (net 141))
(via (at 153.162 67.183) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 141))
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(segment (start 153.135 70.957001) (end 153.54 71.362) (width 0.25) (layer F.Cu) (net 141))
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(segment (start 164.719 55.118) (end 163.576 55.118) (width 0.25) (layer B.Cu) (net 142))
(segment (start 163.576 55.118) (end 156.972 61.722) (width 0.25) (layer B.Cu) (net 142))
(segment (start 156.972 61.722) (end 156.972 67.183) (width 0.25) (layer B.Cu) (net 142))
(segment (start 156.972 67.183) (end 156.972 68.797001) (width 0.25) (layer F.Cu) (net 142))
(segment (start 156.972 68.797001) (end 156.945001 68.824) (width 0.25) (layer F.Cu) (net 142))
(via (at 156.972 67.183) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 142))
(segment (start 156.945001 68.824) (end 156.945001 71.400998) (width 0.25) (layer F.Cu) (net 142))
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(segment (start 156.945 74.598) (end 156.945 72.210999) (width 0.25) (layer F.Cu) (net 142))
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(segment (start 156.945 74.598) (end 156.945 75.073) (width 0.25) (layer F.Cu) (net 142))
(segment (start 149.479 52.578) (end 145.034 52.578) (width 0.25) (layer F.Cu) (net 143))
(segment (start 145.034 52.578) (end 144.145 53.467) (width 0.25) (layer F.Cu) (net 143))
(segment (start 147.135 67.506) (end 147.135 68.824) (width 0.25) (layer F.Cu) (net 143))
(segment (start 144.145 53.467) (end 144.145 66.167) (width 0.25) (layer F.Cu) (net 143))
(segment (start 144.145 66.167) (end 145.161 67.183) (width 0.25) (layer F.Cu) (net 143))
(segment (start 145.161 67.183) (end 146.812 67.183) (width 0.25) (layer F.Cu) (net 143))
(segment (start 146.812 67.183) (end 147.135 67.506) (width 0.25) (layer F.Cu) (net 143))
(segment (start 147.135 71.401) (end 147.54 71.806) (width 0.25) (layer F.Cu) (net 143))
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(segment (start 147.135 70.957) (end 147.54 71.362) (width 0.25) (layer F.Cu) (net 143))
(segment (start 147.134999 71.703) (end 147.540001 71.298) (width 0.25) (layer F.Cu) (net 143))
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(segment (start 150.241 66.548) (end 150.945 67.252) (width 0.25) (layer F.Cu) (net 144))
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(segment (start 145.669 66.548) (end 150.241 66.548) (width 0.25) (layer F.Cu) (net 144))
(segment (start 144.907 65.786) (end 145.669 66.548) (width 0.25) (layer F.Cu) (net 144))
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Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(zone (net 20) (net_name +5VA) (layer F.Cu) (tstamp 0) (hatch edge 0.508)
Latest changes.
2015-11-08 15:13:56 +00:00
(connect_pads (clearance 0.508))
(min_thickness 0.254)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
Latest changes.
2015-11-08 15:13:56 +00:00
(polygon
(pts
Final version.
2015-11-29 23:35:28 +00:00
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Latest changes.
2015-11-08 15:13:56 +00:00
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(filled_polygon
Latest changes.
2015-11-08 15:13:56 +00:00
(pts
Final version.
2015-11-29 23:35:28 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
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Latest changes.
2015-11-08 15:13:56 +00:00
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(filled_polygon
Latest changes.
2015-11-08 15:13:56 +00:00
(pts
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
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Latest changes.
2015-11-08 15:13:56 +00:00
)
)
Final version.
2015-11-29 23:35:28 +00:00
(filled_polygon
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)
)
Latest changes.
2015-11-08 15:13:56 +00:00
)
routed some more.
2015-11-17 16:48:00 +00:00
(zone (net 96) (net_name EN-) (layer B.Cu) (tstamp 0) (hatch edge 0.508)
Latest changes.
2015-11-08 15:13:56 +00:00
(connect_pads (clearance 0.508))
(min_thickness 0.254)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
Latest changes.
2015-11-08 15:13:56 +00:00
(polygon
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Final version.
2015-11-29 23:35:28 +00:00
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Latest changes.
2015-11-08 15:13:56 +00:00
)
)
Latest revision. Still need to connect the rest of the IOs. Increased PCB footprint to 100x100 to fit into Phoenix UM100 DIN Rail carriers.
2015-11-09 00:15:24 +00:00
(filled_polygon
Latest changes.
2015-11-08 15:13:56 +00:00
(pts
Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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Final version.
2015-11-29 23:35:28 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
(xy 144.526 86.614) (xy 144.526 77.724) (xy 176.784 77.724) (xy 202.438 61.722) (xy 213.106 61.722)
Final version.
2015-11-29 23:35:28 +00:00
(xy 213.106 87.376) (xy 223.901 95.25) (xy 223.901 103.886) (xy 183.388 103.886) (xy 169.926 127.635)
routed some more.
2015-11-17 16:48:00 +00:00
(xy 169.926 141.732) (xy 144.526 141.732)
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Major routing done
2015-11-22 00:17:10 +00:00
(xy 212.979 87.376) (xy 212.989006 87.42541) (xy 213.031159 87.478605) (xy 223.774 95.31456) (xy 223.774 103.759)
Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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Final version.
2015-11-29 23:35:28 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
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Final version.
2015-11-29 23:35:28 +00:00
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routed some more.
2015-11-17 16:48:00 +00:00
(xy 188.308 100.71075) (xy 188.14925 100.552) (xy 188.00869 100.552) (xy 187.775301 100.648673) (xy 187.596673 100.827302)
Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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(xy 146.248392 115.325213) (xy 146.317857 115.567397) (xy 146.832707 115.751077) (xy 146.701632 115.757638) (xy 146.317857 115.916603)
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Final version.
2015-11-29 23:35:28 +00:00
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Major routing done
2015-11-22 00:17:10 +00:00
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(xy 146.068787 107.956392) (xy 145.826603 108.025857) (xy 145.639856 108.549302) (xy 144.653 108.549302) (xy 144.653 107.776787)
(xy 146.248392 107.776787) (xy 147.049 108.577395) (xy 147.849608 107.776787) (xy 147.794989 107.586359) (xy 148.699802 107.586359)
(xy 148.873446 108.006612) (xy 149.194697 108.328423) (xy 149.614646 108.502801) (xy 150.069359 108.503198) (xy 150.489612 108.329554)
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Final version.
2015-11-29 23:35:28 +00:00
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Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
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2015-11-30 23:46:52 +00:00
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Isolated SmartSerial channels. Functional isolation only! The clearances are not enough to provide safe clearance for mains voltage.
2015-11-30 20:55:58 +00:00
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Latest changes.
2015-11-08 15:13:56 +00:00
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Initial commit for the Mesa card DB25 breakout board. Just some isolators...
2015-11-03 22:45:50 +00:00
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